According to market surveys automotive microsensors will evolve into a multi-billion dollar business by 2005. Key roles are attributed to inertial sensors for passenger safety systems, and mass flow and pressure sensors for engine management systems. Thin film techniques together with silicon bulk or surface micromachining have been established as preferential processes to achieve reduction of sensor size, weight and cost along with improvements of sensor functionality and reliability. Enhanced sensor performance often pushes the limits of process technology and therefore the need arises very early in the MEMS design process to identify materials and geometry related parameters which are critical with respect to their tolerance band specifications. In order to control these critical parameters, automated wafer level test procedures need to be developed (based preferentially on electrical quantities) and additionally considered for in the sensor design phase (design for test). In analogy to microelectronics 2D wafer maps of critical parameters may give hints on how to improve process stability and how to adapt the sensor design in order to optimize yield. Examples of critical model parameter variations include thermal conductivity, thickness, and shear modulus of thin films.