Patterned micro- and nanowires of several compositions in the solution series of BixTey were electrochemically deposited using Electroplate and Lift (E&L) Lithography on Ultrananocrystalline Diamond (UNCD) templates. The composition of the deposited BixTey wires was controlled by mixing saturated solutions of bismuth nitrate and tellurium in various ratios in the electroplating bath. All wires were electroplated via pulsed depositions at -1.4V vs. the saturated calomel electrode (SCE). The morphology and composition of all wires were studied by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). In general, the BixTey wires were fine-grained and brittle, often fracturing during the liftoff process. By contrast, wires containing less than 5% Te are smooth, and strong enough to support their own weight without a supporting medium for a length of over 100 times the wire diameter.