The scaling of contemporary metal-insulator-metal (MIM) capacitors requires oxides of higher dielectric constant (>10), such as hafnium oxide (∼18) and titanium oxide (∼40). Intensive research of these oxides and oxide stacks is needed to develop them into high quality electronic materials for their application as capacitors in high temperature environments. High-k dielectrics such as HfO2 and HfO2/TiO2/HfO2 have been grown by thermal oxidation to fabricate MIM capacitors on SiO2/Si substrates and on sapphire substrates also. The thermally grown Al/HfO2/TiO2/HfO2/Pt/Ti/SiO2/Si MIM capacitor is reported here for the first time. The MIM capacitor using HfO2/TiO2/HfO2 dielectric film shows a similar frequency dependence using HfO2 dielectric on a SiO2/Si substrate, whilst its voltage linearity coefficients, leakage current and temperature coefficient are higher than the capacitor employing HfO2 dielectric. The MIM capacitor with HfO2 dielectric fabricated on sapphire substrate shows the strongest frequency dependence, voltage linearity coefficient and temperature dependence which is related to the surface roughness of substrate. The high capacitance density of these capacitors, ranging from 5.21 fF/µm2, meets the ITRS requirements for analog capacitor up to 2012. The MIM capacitor using 30nm HfO2 dielectric film illustrates highest capacitance density, 5.21 fF/µm2, a VCC of 236 ppm/V2, a temperature coefficient of 290 ppm/ºC, measured up to 300 ºC, and leakage current density which is 1.3 × 10−7 A/cm2 at 1V.