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We have used synchrotron radiation x-ray microdiffraction to study the microstructure and strain variation of copper interconnects. Different types of local microstructures have been found in different samples. Our data show that the Ti adhesion layer has a dramatic effect on Cu microstructure. On site electromigration test has been conducted and strain profile along the same interconnect line was measured before and after this electrical stressing. Cu fluorescence scan was used to find the mass variations along the line. Voids and hillocks can be clearly identified in this scan. x-ray micro-diffraction was used to measure the strain change around the interesting regions.