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Boron depth distributions are reported for MeV implants into silicon through a variety of masking materials. Silicon is implanted with boron through a 0.1-µm-thick layer of thermally grown silicon dioxide. Secondary ion mass spectrometry (SIMS) shows the projected ranges agree within 10% with data reported in the literature and with results from the computer program TRIM. Silicon dioxide, photoresist, and metal layers are used to mask the high-energy boron implants. The SIMS results indicate that TRIM overestimates the energy loss of MeV boron ions as they pass through photoresist and/or silicon dioxide.
Phosphorus ions were implanted into silicon layers deposited by low pressure chemical vapor deposition onto thermally oxidized silicon substrates. Thermal anneals diffused the phosphorus and the resulting depth profiles were determined by secondary-ion mass spectrometry (SIMS). Transmission electron microscopy shows that the polysilicon layers have a multi-layer pattern of grains. The phosphorus profiles are fit by a Monte Carlo simulation technique that includes both grain and grain-boundary diffusion. The grain-boundary diffusion coefficient is found to be thermally activated with an activation energy of 3.3 eV.
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