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This contribution explores non-user integration in a product development context of the development of a vacuum robot in order to analyse users as well as non-users of a product. While user profiles like the persona have been part of product development and product design for years, the non-user has not been widely explored.
Within this contribution the known concept of the persona is extended and further developed to the non-persona, a profile that describes non-users and why they do not use a certain product, in this case the vacuum robot. Including the non-user in product development offers the chance of addressing yet unidentified product requirements and therefore opening the product up to a bigger audience. This template works for both users and non-users and can be used to include both sides in a
Using kerf-free wafering technologies material losses in semiconductor manufacturing processes can be reduced drastically. By the use of externally applied stress, crystalline materials can be separated along crystal planes with clearly defined thickness. Nevertheless, during this process striations caused by the crack propagation occur. These crack growth features are river and Wallner lines. In this work, we demonstrate a process for spalling that scales favorably for large-area semiconductor substrates with a diameter up to 300 mm. To get rid of the crack growth features, a laser-conditioning process with a high numerical aperture at photon energies below the material bandgap energy, using multi-photon effects is utilized. The process affords a surface roughness Ra after spalling of <1 µm.