An array of copper nanowires (50-110 nm in diameters) was deposited by the electrolysis of CuSO4-H2SO4 solution at room temperature using DC current. The array was created by forcing deposited copper to follow a pattern of nano tunnels. These nano tunnels were formed with two different methods: anodizing an aluminum film that coated on a silicon wafer to form nano holes within oxidized alumina, and etching the ion-tracked polycarbonate membrane.
The difference in top morphologies of the Cu nanowires in these templates is very marked. The copper nano wires deposited in anodized alumina template form the separate spherical balls with diameter of about 10 νμ on the surface of the alumina film, in spite of the template thickness of only 0.5 νm. In contrast, no such Cu agglomeration was formed with copper nano wires deposited in holes of polycarbonate. This variance in copper morphologies is likely due to the difference of the interface energy between Cu and anodic alumina and that of Cu and polycarbonate.