The defects associated with the implantation and diffusion of boron in silicon carbide have been studied using secondary ion mass spectrometry (SIMS) and photoluminescence (PL) imaging and spectroscopy. An n-type epitaxial SiC (1000) substrate was implanted with 2×1014 atoms/cm2 B and annealed to 1700°C. PL data was acquired before and after annealing, and following removal of various thicknesses of the sample by mechanical polishing. Thermal annealing generated a B diffusion profile measured by SIMS to extend to about 3 microns depth. After removing the diffused B layer, a PL spectral feature at 415nm disappeared, which is consistent with its previous identification as arising from donor-acceptor pairs (DAP). The D1 spectral features survived polishing, supporting previous suggestions that these features are intrinsic defects due to the di-interstitial (Ic-Ic or Isi-Isi) or di-vacancy (Vc-Vc or Vsi-Vsi) defects.