We have investigated the passivation of low lifetime non-polished Czochralski (CZ) mono-crystalline silicon (c-Si) wafers by hydrogenated amorphous silicon (a-Si:H), deposited by plasma enhanced chemical vapor deposition (PECVD) technique. The dependence of the effective lifetime (τeff) on the deposition parameters including hydrogen gas flow, power and temperature has been studied. Minority carrier lifetime was measured as deposited and also after an annealing step in both quasi-steady-state (QSS) and transient mode of photoconductance decay. By comparison between τeff measured in each of the aforementioned modes, two distinguishable behaviors could be observed. Moreover, to get further insight into the surface passivation mechanism, we have modeled the recombination at a-Si:H/c-Si interface based on the amphoteric nature of dangling bonds. The results of our modeling show that the discrepancy observed between QSS and transient mode is due to the high recombination rate that exists in the bulk of defective CZ wafer and also partly related to the different thicknesses monitored in each mode. So, by comparison between the injection level dependency of τeff measured in QSS and transient modes, we introduce a valuable technique for the evaluation of c-Si bulk lifetime.