The reliability of high performance carbon and beryllium-doped heterojunction bipolar transistors (HBT’s) is investigated using a pulsed mode current stress. After the current stress, the collector current reduction (measured at a fixed Vbe) and the inverted collector current ratio change (measured at two different reverse Vbe biases) are used as measures of HBT degradation due to dopant acceptors migration. For carbon and beryllium doped HBT’s, degradation was found to be only significant beyond a threshold current density (Jth), showing that the carbon doped devices have a higher Jth than that of the Be-doped HBT's. Beyond the Jth, the device degradation is insensitive to the stress current density but depends on the total stress charge. As a result, the device degradation mechanisms of electric field assisted dopant and carrier recombination enhanced dopant migration can be distinguished under pulsed mode current stress.

Pseudomorphic HEMT (PHEMT) devices have demonstrated superior performance at microwave and millimeter wave frequency ranges. They exhibit multi-functional characteristics such as high power, high efficiency and low noise over a broad frequency range (C-band through W-band). Because of their important, broad range of applications, the microwave industry has recently begun developing the PHEMT manufacturing technology in order to cope with the increasing demand for PHEMT insertion into microwave products. In this paper we will discuss the advantages of using PHEMT devices for microwave and millimeter wave applications and provide an overview of the published state-ofthe-art performance of PHEMT devices and monolithic microwave integrated circuits (MMICs) at microwave and millimeter wave frequencies. We will also present recent progress in Hughes PHEMT technology development including device epitaxial design and process enhancements. Finally, we will present recent data on PHEMT reliability.