Rapid thermal annealing is investigated for curing spin-on glass insulating films. The annealed SOG films were mainly evaluated using infrared absorption spectroscopy and by electrical measurement of the defects present at the Si/Sio2 interface. We found in particular after rapid thermal annealing an important densification of the layers as a function of temperature and a reduction of the interfacial state densities which are comparable to classical thermal oxides.

We show that the use of phosphorus doped spin-on glasses as diffusion source is an attractive approach for the formation of shallow junctions in polycrystalline silicon materials. Moreover, this very simple doping process using a glass film can be fruitfully associated to rapid thermal annealing.

We show in this study that RTP-induced defects analysed by Deep Level Transient Spectroscopy (DLTS) are related to residual impurities present in as-grown silicon wafers. For one particular material an activation of a specific residual metallic impurity was observed in the temperature range 800 - 1000°C. This impurity can be returned to an electrically inactive precipitated form by classical thermal annealing (CTA) with a slow cooling rate or neutralized by means of low-energy hydrogen ion implantation.