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In this work, the ultraﬁne nanoporous Ag ribbons were achieved through addition of 2 at.%–6 at.% Ce into the melt-spun Cu-Ag alloys and applying different electrochemical dealloying potentials. The dendritic morphology of the ligaments in the dealloyed Cu80Ag20 alloy varied to be equiaxial due to the addition of Ce, and the pore size reduced from 200 nm to less than 60 nm. The nanoporous Ag with an average pore size of ∼15 nm was obtained from the Cu74Ag20Ce6 alloy. The pore and ligament sizes of the nanoporous Ag prepared from the Cu76Ag20Ce4 alloy exhibited an increasing tendency with the increase of applied potentials, while the dealloyed Cu78Ag20Ce2 had an opposite variation. Moreover, the addition of Ce into the Cu-Ag alloys also promoted the dealloying. Nanoporous Ag exhibited the stronger enhancement of the surface enhanced Raman scattering effects with the increase of Ce contents in the precursory alloys.
Cu/Si composite may be a novel and high-performance material for electronic packaging if the advantages of copper and silicon components are preserved. Because of the severe diffusional reaction between copper and silicon at elevated temperature, efforts are impeded to achieve a bulk Cu/Si composite. Here, by coating a sol-gel-derived Al2O3 film on the Si particle surface, the bulk Cu/Si composites were obtained by the powder metallurgy method. In the prepared Cu/Si composite, Cu forms a continuous matrix while Si particles are homogeneously dispersed in Cu matrix. High-resolution transmission electron microscopy observation indicates that only weak interfacial reaction occurs at the Cu/Al2O3/Si interface and forms a narrow interfacial reaction zone. The thermal diffusivity of the composite at 25 °C is about 30.6 mm2 s−1, over 10 times larger than that of Cu/Si material without Al2O3 film.
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