This chapter presents a number of subsystem-level modules that benefit from an
LCP implementation. The first module, in section 7.1, is a long time delay (LTD)
circuit with amplitude compensation. This module demonstrates the advantages of
homogenous dielectric core and ply layers in a multilayer build. Known analytic
solutions for transmission lines may be readily applied for first-pass success.
In addition, the homogenous multilayer build achieves amplitude compensation
through novel LCP transmission line implementations. Lastly, this module
demonstrates LCP’s surface mount (SMT) component compatibility with
commercially available MEMS switches.
The second module, in section 7.2, is a push–pull amplifier. This module
demonstrates how LCP’s multilayer construction easily allows minimally
short bondwires for high-performance chip interconnect. Further, this module
integrates high-performance LCP baluns to achieve excellent even-mode distortion
cancellation. This module also demonstrates how LCP lends itself naturally to
the higher-level integration of LCP-enhanced passives.
Lastly, a receiver module with a built-in phased-array antenna is described in
section 7.3 . In this receiver module , LCP is demonstrated to provide a
convenient platform for mechanically flexible electronics. Passive antenna
structures are designed directly into the LCP build. Active semiconductor chips
are packaged into this platform to show how LCP is ideally suited for building
up large systems.
Each module represents advanced research based on an LCP platform that extends
the electrical performance and mechanical functionality of today’s subsystem