The performance of commercially available silicon carbide (SiC) power devices is limited due to inherently high density of screw dislocations (SD), which are necessary for maintaining polytype during boule growth and commercially viable growth rates. The NASA Glenn Research Center (GRC) has recently proposed a new bulk growth process based on axial fiber growth (parallel to the c-axis) followed by lateral expansion (perpendicular to the c-axis) for producing multi-faceted m-plane SiC boules that can potentially produce wafers with as few as one SD per wafer. In order to implement this novel growth technique, the lateral homoepitaxial growth expansion of a SiC fiber without introducing a significant number of additional defects is critical. Lateral expansion is being investigated by hot wall chemical vapor deposition (HWCVD) growth of 6H-SiC a/m-plane seed crystals (0.8mm x 0.5mm x 15mm) designed to replicate axially grown SiC single crystal fibers. The post-growth crystals exhibit hexagonal morphology with approximately 1500 μm (1.5 mm) of total lateral expansion. Preliminary analysis by synchrotron white beam x-ray topography (SWBXT) confirms that the growth was homoepitaxial, matching the polytype of the respective underlying region of the seed crystal. Axial and transverse sections from the as-grown crystal samples were characterized in detail by a combination of SWBXT, transmission electron microscopy (TEM) and Raman spectroscopy to map defect types and distribution. X-ray diffraction analysis indicates the seed crystal contained stacking disorders and this appears to have been reproduced in the lateral growth sections. Analysis of the relative intensity for folded transverse acoustic (FTA) and optical (FTO) modes on the Raman spectra indicate the existence of stacking faults (SFs). Further, the density of stacking faults is higher in the seed than in the grown crystal. Bundles of dislocations are observed propagating from the seed in m-axis lateral directions. Contrast extinction analysis of these dislocation lines reveals they are edge type basal plane dislocations that track the growth direction. Polytype phase transition and stacking faults were observed by high-resolution TEM (HRTEM), in agreement with SWBXT and Raman scattering.

Using transmission electron microscopy, we have analyzed dislocations in AlN nucleation layers and GaN films grown by metallorganic chemical vapor deposition (MOCVD) on the (0001) surface of epitaxially-grown 4H-SiC mesas with and without steps. For 4H-SiC substrates free of SiC surface steps, half-loop nucleation and glide parallel to the AlN/SiC interfacial plane play the dominant role in strain relief, with no mechanism for generating threading dislocations. In contrast, 4H-SiC mesa surfaces with steps give rise to regions of high stress at the heteroepitaxial interface, thereby providing an environment conducive to the nucleation and growth of threading dislocations, which act to accommodate misfit strain by the tilting of threading edge dislocations.

This paper reports the influence of screw dislocations on the lateral/vertical growth behavior of chemical vapor deposited (CVD) on-axis homoepitaxial 4H-SiC films grown on patterned mesas. Electron channeling contrast imaging (ECCI) was utilized to image both atomic steps and dislocations while the film structure/orientation was determined using electron backscatter diffraction (EBSD). The presence and position of screw dislocations within the mesa impacted the resultant film thickness, lateral shape, and atomic step morphology. Mesa side walls that incline inwards due to faceting during screw-dislocation driven vertical film growth can intersect with the dislocation step sources near the side walls. If this occurs for all screw dislocations on a mesa, we observe a transition towards laterally dominated growth that produces webbed structures and films surfaces exhibiting significantly lower step densities. Transition from vertical to lateral dominated growth is consistent with ECCI imaged dislocation very near a mesa side wall.

The interpretation of ECCI images in the forescattered geometry presents a more complex diffraction configuration than that encountered in the backscattered geometry. Determining the Kikuchi line that is the primary source of image intensity often requires more than simple inspection of the electron-channeling pattern. This problem can be addressed, however, by comparing recorded ECCI images of threading screw dislocations in 4H-SiC with simulated images. An ECCI image of this dislocation is found to give the orientation of the dominant Kikuchi line, greatly simplifying the determination of the diffraction simulation. In addition, computed images of threading screw dislocations in 4H-SiC were found to exhibit channeling contrast essentially identical to that obtained experimentally by ECCI and allowing determination of the dislocation Burgers vector.

This paper updates recent progress made in growth, characterization, and understanding of high quality homoepitaxial and heteroepitaxial films grown on step-free 4H-SiC mesas. First, we report initial achievement of step-free 4H-SiC surfaces with carbon-face surface polarity. Next, we will describe further observations of how step-free 4H-SiC thin lateral cantilever evolution is significantly impacted by crystal faceting behavior that imposes non-uniform film thickness on cantilever undersides. Finally, recent investigations of in-plane lattice constant mismatch strain relief mechanisms observed for heteroepitaxial growth of 3C-SiC as well as 2H-AlN/GaN heterofilms on step-free 4H-SiC mesas will be reviewed. In both cases, the complete elimination of atomic heterointerface steps on the mesa structure enables uniquely well-ordered misfit dislocation arrays to form near the heterointerfaces with remarkable lack of dislocations threading vertically into the heteroepilayers. In the case of 3C-SiC heterofilms, it has been proposed that dislocation half-loops nucleate at mesa edges and glide laterally along the step-free 3C/4H interfaces. In contrast, 3C-SiC and 2H-AlN/GaN heterofilms grown on 4H-SiC mesas with steps exhibit highly disordered interface misfit dislocation structure coupled with 100X greater density of dislocations threading through the thickness of the heteroepilayers. These results indicate that the presence of steps at the heteroepitaxial interface (i.e., on the initial heteroepitaxial nucleation surface) plays a highly important role in the defect structure, quality, and relaxation mechanisms of single-crystal heteroepitaxial films.

This paper presents experimental atomic force microscope (AFM) observations of the surface morphology of as-grown (111) silicon-face 3C-SiC mesa heterofilms. Wide variations in 3C surface step structure are observed as a function of film growth conditions and film defect content. The vast majority of as-grown 3C-SiC surfaces consisted of trains of single bilayer height (0.25 nm) steps. Macrostep formation (i.e., step-bunching) was rarely observed, and then only on mesa heterofilms with extended crystal defects. As supersaturation is lowered by decreasing precursor concentration, terrace nucleation on the top (111) surface becomes suppressed, sometimes enabling the formation of thin 3C-SiC film surfaces completely free of steps. For thicker films, propagation of steps inward from mesa edges is sometimes observed, suggesting that enlarging 3C mesa sidewall facets begin to play an increasingly important role in film growth. The AFM observation of stacking faults (SF's) and 0.25 nm Burgers vector screw component growth spirals on the as-grown surface of defective 3C films is reported.

Silicon carbide (SiC) based gas sensors have the ability to meet the needs of a range of aerospace applications including leak detection, environmental control, emission monitoring, and fire detection. While each of these applications require that the sensor and associated packaging be tailored for that individual application, they all require sensitive detection. The sensing approach taken to meet these needs is the use of SiC as a semiconductor in a Schottky diode configuration due to the demonstrated high sensitivity of Schottky diode-based sensors. However, Schottky diode structures require good control of the interface between the gas sensitive metal and SiC in order to meet required levels of sensitivity and stability. Two examples of effort to better control the SiC gas sensitive Schottky diode interface will be discussed. First, the use of chrome carbide as a barrier layer between the metal and SiC is discussed. Second, we report the first use of atomically flat SiC to provide an improved SiC semiconductor surface for gas sensor deposition. An example of the demonstration of a SiC gas sensor in an aerospace applications is given. It is concluded that, while significant progress has been made, the development of SiC gas sensor systems is still at a relatively early level of maturity for a number of applications.

Silicon carbide (SiC) is rapidly becoming the substrate of choice for the development of high frequency and high power electronic devices employing the III-V nitride family of materials. This heteroepitaxial growth system continues to receive considerable attention, as materials issues remain the fundamental limiters to device performance. The heteroepitaxial growth of gallium nitride (GaN) thin films on stepped and step-free 4H SiC surfaces is reported. Step-free SiC surfaces are created by mesa patterning of a SiC wafer and subsequent epitaxial growth in a process described previously. This process results in a collection of both step-free and stepped surfaces on a given sample. We have employed an established metalorganic chemical vapor deposition process to grow first a thin (1200Å) aluminum nitride (AlN) nucleation layer and then a 2 μm thick GaN thin film. We have interrupted growth at various stages of AlN and GaN growth to evaluate the growth evolution using atomic force microscopy (AFM). The results show marked differences in the manner in which the initial AlN layer deposits. Nucleation is random with elongated grains on step-free SiC surfaces, while stepped surfaces have round nuclei of uniform dimensions and a high degree of spatial correlation with the nuclei arranged in rows. These differences diminish as the AlN layer approaches the desired thickness. Growth of the GaN epilayer is also markedly different on the two types of surfaces with step-free surfaces leading to random and low density nucleation of crystallites that remain as single grains for long growth times, whereas the stepped surfaces have large numbers nuclei that rapidly grow laterally. Cross-sectional transmission electron microscopy (TEM) reveals that grain sizes are 2–3X larger on step-free surfaces.

This paper reports initial demonstration of a cantilevered homoepitaxial growth process that places screw dislocations at predetermined lateral positions in on-axis 4H-SiC mesa epilayers. Thin cantilevers were grown extending toward the interior of hollow pre-growth mesa shapes etched into an on-axis 4H-SiC wafer, eventually completely coalescing to form roofed cavities. Each completely coalesced cavity exhibited either: 1) a screw dislocation growth spiral located exactly where final cantilever coalescence occurred, or 2) no growth spiral. The fact that growth spirals are not observed at any other position except the central coalescence point suggests that substrate screw dislocations, initially surrounded by the hollow portion of the pre-growth mesa shape, are relocated to the final coalescence point of the webbed epilayer roof. Molten potassium hydroxide etch studies revealed that properly grown webbed cantilevers exhibited no etch pits, confirming the superior crystal quality of the cantilevers.

This paper updates on-going experimental and theoretical investigations of non-micropipe defects imaged by synchrotron white beam X-ray topography (SWBXT) in SiC devices and epitaxial layers. Computer-based thermal modeling of screw-dislocation related breakdown in SiC diodes has been initiated to gain insights into internal temperature profiles as a function of microplasma power. A preliminary study of epitaxial 4H- and 6H-SiC p+n mesa diodes indicates that very low angle boundaries, whose electrical properties have not previously been reported, do not significantly impact DC I-V properties (forward and reverse) measured at biases less than 70% of the SiC breakdown field. The presence of very small growth pits on the surface of commercial 4H-SiC epitaxial layers, almost undetectable by high magnification optical microscopy, was revealed by atomic force microscopy and found to correspond to the locations of closed core screw dislocations imaged by SWBXT.