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High quality and high speed cutting of 4H-SiC JFET wafers including PCM structures by using Thermal Laser Separation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1693 / 2014
- Published online by Cambridge University Press:
- 10 June 2014, mrss14-1693-dd04-03
- Print publication:
- 2014
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- Article
- Export citation