Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-19T12:51:05.591Z Has data issue: false hasContentIssue false
  • English
  • Français

Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity– ERRATUM

Published online by Cambridge University Press:  10 January 2014

Xiao Na Li ,
Li Rong Zhao ,
Zhen Li ,
Li Jun Liu ,
Cui Min Bao ,
Jinn P. Chu  and
Chuang Dong

Abstract

An abstract is not available for this content. As you have access to this content, full HTML content is provided on this page. A PDF of this content is also available in through the ‘Save PDF’ action button.
Type
Erratum
Information
Journal of Materials Research , Volume 29 , Issue 4 , 28 February 2014 , pp. 605
Copyright
Copyright © Materials Research Society 2013 

doi: 10.1557/jmr.2013.355, Published by Materials Research Society with Cambridge University Press, 20 December 2013.

In Li et al., the affiliation Key Laboratory of Materials Modification by Laser School of Mechanical Engineering, Dalian University of Technology, Ministry of Education, Dalian 116024, China for Xiao Na Li, Li Rong Zhao, Li Jun Liu, and Chuang Dong is incorrect. It should read: Key Laboratory of Materials Modification by Laser, Ion and Electron Beams, Dalian University of Technology, Ministry of Education, Dalian 116024, China

The publisher regrets the mistake.

References

REFERENCE

Li, X.N., Zhao, L.R., Li, Z., Liu, L.J., Bao, C.M., Chu, J.P., and Dong, C.: Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity. J. Mater. Res. 28(24), 3367–3373 (2013).CrossRefGoogle Scholar