Research Article
Rational Design of Highly Filled Reactive Resins for Electronic Material Applications with Multiple Performance Constraints
- Published online by Cambridge University Press: 26 February 2011, 0968-V07-04
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Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders
- Published online by Cambridge University Press: 26 February 2011, 0968-V04-02
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Effect of Zn Addition on the Interfacial Reactions between Cu and Lead-Free Solders
- Published online by Cambridge University Press: 26 February 2011, 0968-V03-03
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Mechanical Property Measurement of Interconnect Materials by Magnetostrictive Sensors
- Published online by Cambridge University Press: 26 February 2011, 0968-V04-07
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Factors Affecting the Mechanical Properties of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joints
- Published online by Cambridge University Press: 26 February 2011, 0968-V04-04
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Parylene-PDMS Bilayer Coatings for Microelectronic and MEMS Packaging
- Published online by Cambridge University Press: 26 February 2011, 0968-V07-07
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Time-Lapse Measurements of Creep in Au-Sn Die Bonds
- Published online by Cambridge University Press: 26 February 2011, 0968-V04-06
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Electric Current Induced Brittle Failure of Eutectic Lead and Lead-free Solder Joints with Electroless Ni-P Metallization
- Published online by Cambridge University Press: 26 February 2011, 0968-V05-06
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Effect of crystallization on Adhesion Strength of External Electrode in LTCC
- Published online by Cambridge University Press: 26 February 2011, 0968-V07-11
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High Performance Conductive Adhesives for Lead-Free Interconnects
- Published online by Cambridge University Press: 26 February 2011, 0968-V07-01
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Advanced Thermal Interface Materials
- Published online by Cambridge University Press: 26 February 2011, 0968-V05-10
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Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints
- Published online by Cambridge University Press: 26 February 2011, 0968-V03-01
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Thermal Management in High-Density, Stacked-Die, Multi-chip Modules
- Published online by Cambridge University Press: 26 February 2011, 0968-V05-08
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Evaluation of Void Formation Mechanism in Cu Thin Films; Separation of The Effect of Electron Wind Force and Stress
- Published online by Cambridge University Press: 26 February 2011, 0968-V05-07
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Reactive Multilayer Foils for Silicon Wafer Bonding
- Published online by Cambridge University Press: 26 February 2011, 0968-V02-06
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Well-Aligned In-situ Formed Open-End Carbon Nanotube for Device and Assembly Applications
- Published online by Cambridge University Press: 26 February 2011, 0968-V06-05
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Thermodynamics and Kinetics of Oxidation of Pure Indium Solders
- Published online by Cambridge University Press: 26 February 2011, 0968-V03-07
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A Novel PPF Technique--Sn-PPF: Effects of In-Situ Formation Cu-Sn-Ni Intermetallic Nano-Layer on Electronic Packaging Performances
- Published online by Cambridge University Press: 26 February 2011, 0968-V03-08
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Smart Lead-Free Solders via Shape-Memory Alloy Reinforcement
- Published online by Cambridge University Press: 26 February 2011, 0968-V06-04
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Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2
- Published online by Cambridge University Press: 26 February 2011, 0968-V07-10
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