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Deformation Mechanisms in Thin Films
- Published online by Cambridge University Press: 15 February 2011, 3
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Understanding Void Phenomena in Metal Lines: Effects of Mechanical and Electromigration Stress
- Published online by Cambridge University Press: 15 February 2011, 15
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Prediction and Prevention of Stress Migration and Electromigration Damage in Passivated Lines
- Published online by Cambridge University Press: 15 February 2011, 27
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High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress
- Published online by Cambridge University Press: 15 February 2011, 33
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Estimation of Thermal Stresses and Stress Concentrations in Confined Interconnect Lines of Rectangular Cross Section
- Published online by Cambridge University Press: 15 February 2011, 39
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A Simple Model for Stress Voiding in Passivated Thin Film Conductors
- Published online by Cambridge University Press: 15 February 2011, 45
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Electromigration Reliability Simulator
- Published online by Cambridge University Press: 15 February 2011, 51
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Vacancy Supersaturation Model for Electromigration Failure Under DC and Pulsed DC Stress
- Published online by Cambridge University Press: 15 February 2011, 57
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Reliability of Interconnects Exhibiting Bimodal Electromigrationinduced Failure Distributions
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Microstructure Evolution in Metal Interconnects
- Published online by Cambridge University Press: 15 February 2011, 73
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Microstructure and the Development of Electromigration Damage in Narrow Interconnects
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Electromigration in Bicrystal Al Lines
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A Microscopical and Statistical Study of Electromigration Damage and Failure in Al-4wt.%Cu Tracks
- Published online by Cambridge University Press: 15 February 2011, 101
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Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films
- Published online by Cambridge University Press: 15 February 2011, 107
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Effects of Film Texture on Electromigration Lifetime Predictions
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Quantitative Analysis of Electromigration-Induced Damage in Al-Based Interconnects
- Published online by Cambridge University Press: 15 February 2011, 119
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Electromigration Performance of Fluorinated Aluminum Films for VLSI Applications
- Published online by Cambridge University Press: 15 February 2011, 125
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Microstructural Aspects of Interconnect Failure
- Published online by Cambridge University Press: 15 February 2011, 131
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Interconnection Challenges of the 1990's
- Published online by Cambridge University Press: 15 February 2011, 145
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Reliable Metallization System for Flip-Chip Optoelectronic Integrated Circuits
- Published online by Cambridge University Press: 15 February 2011, 155
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