Research Article
Low Dielectric Constant Materials for IC Intermetal Dielectric Applications: A Status Report on the Leading Candidates
- Published online by Cambridge University Press: 15 February 2011, 3
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A Study Of Anisotropy Of Spin Cast And Vapor Deposited Polyimide Films Using Internal Reflection Techniques
- Published online by Cambridge University Press: 15 February 2011, 15
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Parylene AF-4: A Low εR Material Candidate For ULSI Multilevel Interconnect Applications
- Published online by Cambridge University Press: 15 February 2011, 21
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Interconnect Process Technology Using Perfluorocyclobutane (PFCB)
- Published online by Cambridge University Press: 15 February 2011, 35
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Fluorocarbon Films from Plasma Polymerization of Hexafluoropropylene and Hydrogen
- Published online by Cambridge University Press: 15 February 2011, 41
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Toughened, Inorganic-Organic Hybrid Materials for Microelectronic Application
- Published online by Cambridge University Press: 15 February 2011, 47
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Fluorinated Heteroaromatic Polyethers for Low Dielectric Constant/High Temperature Applications
- Published online by Cambridge University Press: 15 February 2011, 59
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Thermal Curing Conditions for Low K-Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI
- Published online by Cambridge University Press: 15 February 2011, 71
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Mechanical and Dielectric Properties of Low Permittivity Dielectric Materials
- Published online by Cambridge University Press: 15 February 2011, 79
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Evaluation of PTFE Nanoemulsion as a Low Dielectric Constant Material ILD
- Published online by Cambridge University Press: 15 February 2011, 85
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Nanoporous Silica for Low k Dielectrics
- Published online by Cambridge University Press: 15 February 2011, 91
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Deposition and Characterization of Porous Silica Xerogel Films
- Published online by Cambridge University Press: 15 February 2011, 99
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Low K Mesoporous Silica Films Through Template-Based Processing
- Published online by Cambridge University Press: 15 February 2011, 105
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Chemical Bonding of Fluorine Atoms in Siof Alloys: Microscopic Mechanisms for Reductions in the Dielectric Constant Relative to SiO2
- Published online by Cambridge University Press: 15 February 2011, 111
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The Thermal Stability of Fluorine Doped Silicon Oxide Films Formed by Ecrcvd With SiF4 and O2 Gases
- Published online by Cambridge University Press: 15 February 2011, 119
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Characterization of PECVD Deposited Fluorosilicate Glass (FSG) After CMP and Cleaning
- Published online by Cambridge University Press: 15 February 2011, 127
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PE-CVD of F-Doped SiO2 Thin Films Using Tetraisocyanatesilane and Tetrafluorosilane
- Published online by Cambridge University Press: 15 February 2011, 137
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Effect of Fluorine Addition to Plasma-Enhanced Chemical Vapor Deposition Silicon Oxide Film
- Published online by Cambridge University Press: 15 February 2011, 143
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Thermal Stability of Fluorinated SiO2 Films: Effects of Hydration and Film-Substrate Interaction
- Published online by Cambridge University Press: 15 February 2011, 149
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Diamondlike Carbon Materials as Low-k Dielectrics for Multilevel Interconnects in Ulsi
- Published online by Cambridge University Press: 15 February 2011, 155
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