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Zr Oxide Based Gate Dielectrics with Equivalent SiO2 Thickness of Less than 1.0 nm and Device Integration with Pt Gate Electrode

  • Yanjun Ma (a1) and Yoshi Ono (a1)

Abstract

ZrO2 films are investigated as an alternative to SiO2 gate dielectric below 1.5nm. A maximum accumulation capacitance ∼35 fF/μm2 with a leakage current of less than 0.1 A/cm2 has been achieved for a 3 nm Zr-O film, suggesting that ZrO2 can be scaled to below an equivalent oxide thickness of 0.5 nm. Al and Si doping is also investigated to reduce leakage currents and to increase the crystallization temperature of the film. Submicron MOSFETs with TiN or Pt gate electrodes have been fabricated with these gate dielectrics with excellent characteristics, demonstrating the feasibility of CMOS process integration. In particular, Pt damascene gate PMOS is shown to have the proper threshold voltage for dual metal gate CMOS application.

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Zr Oxide Based Gate Dielectrics with Equivalent SiO2 Thickness of Less than 1.0 nm and Device Integration with Pt Gate Electrode

  • Yanjun Ma (a1) and Yoshi Ono (a1)

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