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X-RAY Determination and Analysis of Residual Stresses in Uniform Films and Patterned Lines of Tungsten

Published online by Cambridge University Press:  21 February 2011

L Maniguet ,
M. Ignat ,
M. Dupeux ,
J.J. Bacmann  and
Ph. Normandon
L Maniguet
Affiliation:
Laboratoire de Thbermodynamique et Physico-Chimie MWtallurgiques, ENSEEG, BP75 38402 St Martin d'Hères -, France
M. Ignat
Affiliation:
Laboratoire de Thbermodynamique et Physico-Chimie MWtallurgiques, ENSEEG, BP75 38402 St Martin d'Hères -, France
M. Dupeux
Affiliation:
Laboratoire de Thbermodynamique et Physico-Chimie MWtallurgiques, ENSEEG, BP75 38402 St Martin d'Hères -, France
J.J. Bacmann
Affiliation:
CEA/CEREMA/DEM/SGS, CENG 85X 38401 Grenoble -, France
Ph. Normandon
Affiliation:
FRANCE TELECOM - CNET, BP.98, 38243 Meylan -, France
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Abstract

The determination by X-ray diffraction of the elastic strain tensors and the corresponding stress tensors in uniform films and patterned lines of tungsten was used to investigate the effect of line width. The stresses were found to increase with increasing line width. These experimental results are discussed with respect to the values obtained from a model using a distributed force in the line. The results of the calculations are in agreement with the X-ray measurements. The edge effects appear to be significant for tungsten lines.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 217
Copyright
Copyright © Materials Research Society 1993

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References

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