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The Use of Secondary Ion Mass Spectrometry to Investigate Wire Bonding Yield Problems on Gold Contacts

  • G. R. Mount (a1), T. L. Walzak (a2), Y. C. Koo (a3) and D. McClure (a4)


With ongoing demand for high density wiring and high I/O on VLSI chips, the requirement of high wire bond yield is a challenge to achieve low cost, high performance and reliable products. Secondary Ion Mass Spectrometry (SIMS) was used to investigate the metallurgical contaminants on the gold wire bond pads and their impact on wire bond yields. SIMS depth profile studies showed that copper and nickel in concentrations greater than 1 wt% caused poor wire bondability, while copper concentration at less than 0.1 wt% resulted in good bondability of Al ultrasonic wire bonded to the gold pads.



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