Martinez, M.A, 1994, Solid State Technology.
 Komanduri, R, 1996, On material removal mechanisms in finishing of advanced ceramics and glasses, Annals of the CIRP, 45:509–514.
 Evans, C.J., Paul, E., Dornfeld, D., Lucca, D.A., Byrne, G., Tricard, M., Klocke, F., Dambon, O., Mullany, B.A, 2003, Material removal mechanisms in lapping and polishing, Annals of the CIRP, 52/2:611–634.
 Wang, C., Sherman, P., Chandra, A., Dornfeld, D., 2005, Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical MechanicalPlanarization, Annals of the CIRP, 54/1:309–312.
 Bastawros, A.F., Chandra, A., Guo, Y., Yan, B., 2002, Pad Effects on Material Removal Rate in Chemical Mechanical Planarization, J. Electronic Materials, 31/10:1–10.
 Luo, J., Dornfeld, D., 2003, Effects of abrasive size distribution in chemical mechanical planarization: modeling and verification, IEEE Trans. Semiconductor Manufacturing, 16/3:469–476.
 Lin, M Y., Lindsay, H.M., Weitz, D.A., Klein, R., Ball, R.C., Meakin, P., 1989, Universality of Fractal Aggregates as Probed by Light Scattering, Proceedings of the Royal Society of London A, 423/1864:71–87.
 Lin, M Y., Lindsay, H.M., Weitz, D.A., Klein, R., Ball, R.C., Meakin, P., 1990, Universal diffusion-limited colloid aggregation, Journal of Physics: Condensed Matter, 2:3093–3113.
 Ball, R.C., Weitz, D.A., Witten, T.A., Leyvraz, F., 1987, Universal kinetics in reaction limited aggregation, Physical Review Letters, 58/3.
 Komulski, Marek, 2001, Chemical properties of material surfaces, New York.
 Che, W., Guo, Y.J., Chandra, A., Bastawros, A., 2005, A Scratch Intersection Model of Material Removal During Chemical Mechanical Planarization (CMP), Journal of Manufacturing Science and Engineering, 127/3:545–554.
 Bastaninejad, M., Goodarz, A., 2005, Modeling the Effects of Abrasive Size Distribution, Adhesion and Surface Plastic Deformation on Chemical-Mechanical Polishing, J. of The Electrochemical Society, 152/9: 1875–1877.
 Che, W, Bastawros, A, Chandra, A, et al., Surface evolution during the chemical mechanical planarization of copper, CIRP Annals-Manufacturing Technology, Volume: 55, Issue: 1, Pages: 605–608 Published: 2006.
 Chandra, A., P, Karra and M, Dorothy., Implications of Arrow's Theorem in Modeling of Multiscale Phenomena: An Engineering Approach, Submitted to Journal of Design, also presented at NSF CMMI Grantee conference, Knoxville, Jan 2008.
 Chandra, A., Unpublished work, 2009.
 Armini, S., 2007, Composite particles for chemical-mechanical planarization applications, Dissertation, IMEC, Kapeldreef 75, Leuven, Belgium.
 Gopal, T., Talbot, J.B., Use of Slurry Colloidal Behavior in Modeling of Material Removal Rates in CMP, Journal of The Electrochemical Society, 154/6, H507–H511, 2007.
 Boroucki, L., Mathematical Modeling of Polish-rate Decay in Chemical-Mechanical Polishing, Journal of Engineering Mathematics
43, 105–114, 2002.