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Transient Thermoelectric Cooling of thin Film Devices

  • A. Ravi Kumar (a1), R.G. Yang (a1), G. Chen (a1) and J.-P. Fleurial (a2)

Abstract

We report theoretical analysis for the transient thermal response of thermoelectric (TE) element and the integrated thin-film devices. It is predicted that the TE element geometry and applied current pulse shape influences the transient response of the system. Analysis for the integrated systems shows that the transient response is affected by the effusivity of the attached mass. This analysis provides a means to examine the effectiveness of thermal management of the thin-film devices, particularly semiconductor lasers, using the transient mode operation of thermoelectric coolers, and also suggests geometry constraints and optimum pulse shapes for an integrated system.

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Transient Thermoelectric Cooling of thin Film Devices

  • A. Ravi Kumar (a1), R.G. Yang (a1), G. Chen (a1) and J.-P. Fleurial (a2)

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