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TiN Metallization Barriers: From 1.2μ to 0.35μ Technology

Published online by Cambridge University Press:  25 February 2011

Fabio Pintchovski  and
Ed Travis
Fabio Pintchovski
Affiliation:
Advanced Products Research and Development Laboratory Motorola, Inc. Austin, Texas 78721
Ed Travis
Affiliation:
Advanced Products Research and Development Laboratory Motorola, Inc. Austin, Texas 78721
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Abstract

The evolution of modern integrated circuit technology to sub micron dimensions has brought about a number of challenges, specially in the field of metallization. Decreasing junction depths have imposed stringent demands on the materials used for the electrical contacts. This is due to the potential interactions between the contact metal and silicon (or suicide in the case of salicide processes) causing junction leakage and/or shorting. The solution most commonly applied to this problem is that in which a barrier material is interposed between the metallization and the contact. The material most often selected for this purpose has been TiN. TiN can be deposited via the reactive sputtering of Ti in a N2 atmosphere or it can be also obtained by sputtering Ti and then reacting it with either N2 or NH3. Shrinking VLSI dimensions have brought about the need for improved planarization for the purposes of metal definition. It has also prevented the tapering of contacts for space saving reasons. Both of these issues resulted in deep, straight wall contacts with aspect ratios greater than 1 that cannot be metallized appropriately with conventional sputtering techniques. These requirements have driven the development of a conformai CVD TiN barrier process. This paper describes the evolution of the TiN metallization barrier from the requirements of 1.2μ to 0.35μ technologies.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 777
Copyright
Copyright © Materials Research Society 1992

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References

REFErences

1. Nicolet, M. A., Thin Solid Films 52, 415 (1978).CrossRefGoogle Scholar
2. Wittmer, M., Appl. Phys. Lett. 26, 456 (1980).Google Scholar
3. Ting, C. Y. and Wittmer, M., Thin Solid Films 96, 327 (1982).Google Scholar
4. Chang, P. H., Hawkins, R., Bonifield, T. D., and Melton, L. A., Appl. Phys. Lett. 52, 272 (1988).Google Scholar
5. Adams, A. C., Solid State Techol., 24, 178 (1981).Google Scholar
6. Okamoto, T., Tsukamoto, K., Shimizu, M., Mashiko, Y., and Matsukawa, T., Symp. on VLSI Tech. 1986, 51.Google Scholar
7. Maeda, T., Shima, S., Nakayama, T., Kakumu, M., Mori, K., Iwabuchi, S., Aoki, R., and Matsunaga, J., IEDM Proceedings 1985, 610 - 613.Google Scholar
8. Poitevin, J. M., Lemperiere, G., and Tardy, J., Thin Solid Films 52, 69 (1982).Google Scholar
9. Wittmer, M., Studer, B., and Melchoir, H., J. Appl. Phys. 52, 5722 (1981).Google Scholar
10. Ham, W. E., Abrahams, M. S., and Buiocchi, C. J., J. Electrochem Soc. 128, 1623 (1981).Google Scholar
11. Pintchovski, F., White, T., Travis, E., Tobin, P. J. and Price, J. B., Tungsten and Other Refractory Metals for VLSI Applications III, ed. Wells, V. A., (Materials Research Society, 1988) p. 65.Google Scholar
12. Sherman, A., J. Electrochem. Soc. 137, (1990).Google Scholar
13. Travis, E. O., Fiordalice, R. W., Klein, J., Pintchovski, F., Kawasaki, H. and Hegde, R.. Tungsten and Other Refractory Metals for VLSI Applications VI. ed Joshi, R., (Materials Research Society, 1991) p. 487.Google Scholar