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A Three Dimensional Self-folding Package (SFP) for Electronics

  • David Gracias (a1), Jeong-Hyun Cho (a2) and Steve Hu (a3)


We describe the concept of a 3D self-folding package (SFP) for sensors and electronic devices. The strategy is based on a self-assembly strategy wherein 2D panels interconnected with hinges spontaneously fold-up when they are released from the substrate; self-folding can be triggered by temperature or selected chemicals. The strategy enables packaging of devices in porous polyhedral geometries that can either be untethered or substrate-bound. Self-folding can enable packaging of devices in small 3D form factors and may enable efficient cooling due to porosity. The utilization of this self-folding platform to enable 3D packaging of cantilever sensors and magnetic field sensitive strain gauges is summarized.



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A Three Dimensional Self-folding Package (SFP) for Electronics

  • David Gracias (a1), Jeong-Hyun Cho (a2) and Steve Hu (a3)


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