Skip to main content Accessibility help
×
Home

Thermal Management in High-Density, Stacked-Die, Multi-chip Modules

  • Thomas Marinis (a1), Dariusz Pryputniewicz (a2), Caroline Kondoleon (a3) and Jason Haley (a4)

Abstract

Very high density multi-chip modules are being manufactured by tiling an alumina substrate with IC chips and passive components, laminating a film of Kapton over them, laser drilling vias to their I/O pads, and interconnecting them with photo patterned, copper metallization. Additional layers of components and interconnects are added on top of the base layer, as needed, to allow greater integration of large circuits. Current products are typically two layers of chips and seven layers of interconnect. As higher power applications have emerged and the power density of IC chips has increased, thermal management has become a significant factor impacting module design. We have been conducting a thermal modeling effort to map the design space for this technology. Our principal objective is to define and evaluate low thermal impedance (heat removal) configurations for a given chip set. A second objective is to determine what gains in module performance might be realized by improvements in material properties or changes in the relative thicknesses of dielectric and metal layers.

Copyright

References

Hide All
1. LeBlanc, John J., et. al., IMAPS HDI 2001, “Process for Fabricating Dense, Chips-First MCMs with Thinned Die”
2. Incropera, Frank P. and DeWitt, David P., Introduction to Heat Transfer, 4th edition, John Wiley & Sons, New York, 2002, p. 371
3. Geuzaine, Christophe and Remacle, Jean-Francois, Gmsh: a three-dimensional finite element mesh generator with built-in pre- and post-processing facilities, http://www.geuz.org/gmsh/
4. Roddeman, Dennis, Tochnog User’s Manual – a free explicit/implicit FE program, November 26, 2003, http://tochnog.sourceforge.net/tnu/tnu.html

Keywords

Thermal Management in High-Density, Stacked-Die, Multi-chip Modules

  • Thomas Marinis (a1), Dariusz Pryputniewicz (a2), Caroline Kondoleon (a3) and Jason Haley (a4)

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed