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The Thermal Effects of CMP as a Particle Augmented Mixed Lubrication Tribosystem

Published online by Cambridge University Press:  21 August 2013

Gagan Srivastava  and
C . Fred Higgs III
Gagan Srivastava
Affiliation:
Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh PA 15213
C . Fred Higgs III
Affiliation:
Mechanical Engineering, Carnegie Mellon University, 5000 Forbes Ave, Pittsburgh PA 15213
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Abstract

Most chemical mechanical polishing (CMP) researchers assume that the polishing occurs in the mixed-lubrication regime, where the applied load on the wafer is supported by the hydrodynamic slurry pressure and the contact stress generated during the pad-wafer contact. Consequently, the particle augmented mixed lubrication (PAML) approach has been employed as an extremely high-fidelity asperity-scale mixed-lubrication CMP model in the past. Recently, a more computationally efficient PAML approach, PAML-lite, which considers the slurry’s fluid and particle dynamics, the pad/wafer contact mechanics, and the resulting material removal, was introduced. The current work presents the PAML-lite framework with the isothermal assumption relaxed. As a result, wafer-scale interfacial temperatures during CMP can be predicted by considering asperity heating and dissipation of the heat into the solid and fluid media in the sliding contact.

Keywords

CMPtribologythermal conductivity
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1560: Symposium BB – Evolutions in Planarization—Equipment, Materials, Techniques and Applications , 2013 , mrss13-1560-bb02-04
Copyright
Copyright © Materials Research Society 2013 

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References

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