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Thermal And Mechanical Properties Of Low K Polymers

  • Chien Chiang (a1), Anne S. Mack (a1), Chuanbin Pan (a1), Yui-Lin Ling (a1) and David B. Fraser (a1)...

Abstract

Low dielectric constant polymers offer many advantages in circuit performance, such as power dissipation, crosstalk and RC delay, when used as inter-layer dielectrics (ILDs). Silicon dioxide, a material commonly used as an ILD has a dielectric constant of 4.0. Organic polymers that have dielectric constant values ranging from 2.0 to 3.0 offer attractive alternatives to SiO2. However, it has been a great challenge to find organic polymers with thermal stability up to 450 °C. We have characterized thermal properties of polymers using thermal desorption analysis. isothermal TGA and FTIR to identify weak functional groups. In addition, we have measured the hardnesses and moduli of these polymers and found that the values are much lower than those of SiO2.Stress distributions in the interconnect system were analyzed using finite element modeling in order to understand potential reliability problems.

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1 Zhang, X., You, L., Dabral, S., Chiang, C., Yaney, D.S., Joshi, R.V., Yang, G.R., Lu, T.M. and McDonald, J.F., ”Planarizing Techniques for Parylene as an Interlayer Dielectric”, Proc. VMIV, P. 168–174, 1993
2. Chiang, C., Richards, C., Vu, Q., Mack, A.S., Fraser, D. B., Yokotsuka, T. and Nakamura, M., ”The Use of CPFP, a New Fluoropolymer as an Interlayer dielectric for ULSI Application”, Extended Abstract #294, ECS spring meeting, 1993
3. Flinn, P.A., Gardner, D. S., and Nix, W.D., IEEE Trans. Electron Devices ED-34, 689, 1987
4.Brian Auman, “Fluorinated Polyimides with Low dielectric Constant, Low Moisture Absorption, and Low Coefficient of Thermal Expansion for Use as Interlayer Dielectrics”, DUMIC Proceedings, P.297-P.304, 1995
5. Hrubesh, L.W., Poco, J. F.,”Aerogel films for Optical, thermal, Acoustic and Electronic Applications”, abstract 11.5, 4th International Symposium on Aerogels, Berkeley, 1994
6. Hendricks, N., Wan, B. and Smith, A., ” Fluorinated Poly(arylethers): Low Dielectric Constant, Thermally Stable Polymers for Sub-half Micron IMD Applications”, DUMIC Proceedings, P. 283–289, 1995
7. ANSYS finite element program, Swanson Analysis Systems, 1992.

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