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Theoretical Analysis of Thermal Conductivity in Amorphous Inter-layer Dielectrics

  • Manu Shamsa (a1), Patrick Morrow (a2) and Shriram Ramanathan (a3)

Abstract

Understanding thermal conduction in interlayer dielectrics (ILDs) is important for the optimal design of interconnect layers in backend semiconductor processing for future high-performance nano-scale devices. Reduced thermal conductivity of porous ILDs for example can adversely affect the temperature rise in the embedded metal lines leading to un-desirable reliability issues and design constraints. In this paper, we report results of our theoretical and experimental investigation of thermal transport in amorphous and porous dielectrics. A phonon-hopping model has been adapted to calculate the thermal conductivity in disordered materials. The value of hopping integral has been calculated by comparing the modeling results with experimental data for various amorphous and porous materials. The model shows reasonable agreement with experimental data for various amorphous materials including SiO2 and other glasses over a wide temperature range from 50K – 300K. The model suggests that the hopping of localized high frequency phonons is a dominant thermal transport mechanism in such material systems.

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1 The International Technology Roadmap for Semiconductors, 2004 update.
2 Chang, T. and Sarasawat, K. C., Symposium on VLSI Circuits of Technical Papers, 21–2, (2003)
3 Shen, Y.-L., J. Vac. Sci. Tech., B 17, 2115 (1999)
4 Shis, W.-Y., Levine, J. and Chang, M., Proc. Adv. Metall. and Interconnect Sys. For ULSI Appl., 479 (1996)
5 Goodson, K.E. and Ju, Y.S., Annu. Rev. Mater. Sci., 29, 261 (1999)
6 Balandin, A., Encyl. Nanosci. Nanotech., 10, 425 (2004)
7 Chiang, T, Shieh, b. and Saraswat, K.C., Symposium on VLSI Circuits of Technical Papers, 38 (2002)
8 Cahill, D. and Pohl, R.O., Sol. State Comm., 70, 927 (1989)
9 Einstein, A., Ann. Phys. 35, 679 (1911)
10 Hu, A., Morgen, M. and Ho, P.S., Appl. Phys. Lett., 77, 145 (2002)
11 Braginsky, L., Lukzen, N., Shklover, V. and Hofmann, H., Phys. Rev. B, 66, 134203 (2002)
12 Orbach, R., J. Non-Cryst. Solid, 164, 917 (1993)
13 Cahill, D.G. and Pohl, R.O., Phys. Rev. B, 35, 4067 (1987)
14 Shamsa, M., Liu, W., Balandin, A.A. and Liu, J., Appl. Phys. Lett. 87, 202105 (2005)
15 Braginsky, L., Shklover, V., Hofmann, H. and Bowen, P., Phys. Rev. B, 70, 134201 (2004)
16 Cahill, D.G., Rev. Sci. Inst., 75, 5119 (2004)
17 Watson, S. K. and Pohl, R.O., Phys. Rev. B, 68, 104203 (2003)
18 Jain, A., Rogojevic, S., Ponoth, S., Gill, W.N., Simonyi, E., Chen, S. and Ho, P.S., J. Appl. Phys., 91, 3275 (2002)

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Theoretical Analysis of Thermal Conductivity in Amorphous Inter-layer Dielectrics

  • Manu Shamsa (a1), Patrick Morrow (a2) and Shriram Ramanathan (a3)

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