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Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films

  • K. P. Rodbell (a1), D. B. Knorr (a2) and D. P. Tracy (a2)

Abstract

A strong correlation was found between film texture, quantified as fiber plots of (111) intensity versus tilt angle from the normal direction, and the resulting electromigration behavior of layered Ti/AlCu/Ti films. Superior electromigration behavior was found for those films which had a low volume fraction of randomly oriented grains, strong and sharp texture. Film microstructure and electromigration lifetime data on DC magnetron sputtered and electron gun evaporated AI-Cu and layered fine lines, fabricated and tested in the same laboratory, are included for a direct comparison. Outstanding electromigration lifetimes were measured for sputtered, layered, submicron films with copper concentrations between 0.12 - 2wt.%Cu. In contrast the electromigration lifetimes of evaporated layered films were found to degrade rapidly at < 2wt.%Cu. This anomalous electromigration behavior was attributed to both film texture and subtle structural differences in the Ti-Al intermetallics formed.

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Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films

  • K. P. Rodbell (a1), D. B. Knorr (a2) and D. P. Tracy (a2)

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