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Texture Control and Electromigration Performance in Al-Based and Cu-Based Layered Interconnects

  • Makiko Kageyama (a1), Kazuhide Abe (a1), Yusuke Harada (a1) and Hiroshi Onoda (a1)

Abstract

Texture control of Al and Cu by underlying refractory metal is discussed. Al texture can be controlled with underlayer metals like as Ti and TiN which have the same atomic arrangement within 3% misfits to Al. Cu texture can be also controlled by underlayer TiN in spite of a large difference in inter-atomic distance of Cu and TiN. Since the epitaxial growth of TiN on Cu is observed, it is suggested that epitaxial growth may occur at the early stage of Cu deposition on TiN.

The electromigration performance was evaluated in double level interconnects with W-stud via. It is confirmed that highly <111> textured Al and Cu have high electromigration resistance. Both the diffusion of Cu in Al-Cu and Al drift are suppressed in <111> textured Al-alloy interconnects, and Cu drift is also suppressed in Cu damascene lines formed on <111> textured TiN. Grain boundary diffusion and the interfacial diffusion would be suppressed in highly textured metals with underlayer and it is speculated that interfacial diffusion is more important in Cu damascene lines.

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1. Howard, J.K. and Ross, R.F., IBM Tech. Rep., 22, p.601, 1968
2. Attardo, M.J. and Rosenberg, R., J.Appl. Phys. 41, pp. 23812386, 1970 10.1063/1.1659233
3. Vaidya, S. and Sinha, A.F., Thin Solid Films 75, pp.253259, 1981
4. Knorr, D.B., Tracy, D.P. and Rodbell, K.P., Appl.Phys.Lett., 59(25), pp.32413243, 1991
5. Kageyama, M., Hashimoto, K. and Onoda, H., Proc.29th IRPS, pp.97101, 1991
6. Onoda, H., Kageyama, M. and Hashimoto, K., J.Appl.Phys., 72(2), pp.885892, 1995
7. Shibata, H., Murota, M. and Hashimoto, K., Jpn.J.Appl.Phys., 32(10), pp.44794484, 1993
8. Toyoda, H., Kawanoue, T., Hasunuma, M., Kaneko, H. and Miyauchi, M., Poc.32th IRPS, pp. 178184
9. Hashimoto, K. and Onoda, H., Appl. Phys. Lett., 19, pp. 120122, 1989
10. Onoda, H., Narita, T., Touchi, K. and Hashimoto, K., Jap.J.Appl.Phys., pp.L1037–L1040, 1995
11. Yoshida, T., Hashimoto, S., Hosokawa, H., Ohwaki, T., Mitsushima, Y. and Taga, Y., Proc.35th IRPS, pp226233, 1997
12. Kageyama, M., Tatara, Y. and Onoda, H., Jap.J.Appl.Phys. 32, pp.46494653, 1993
13. Abe, K., Harada, Y. and Onoda, H., proc 12th VMIC, pp308314, 1995
14. Blech, I.A., J.Appl.Phys. 47(4), pp. 12031208, 1076
15. Blech, I.A., J.Appl, Phys. 48(2), pp.473477, 1977
16. Hu, C-K. and Small, M.B., J.Appl.Phys. 74(2), 969978, 1993
17. Kawasaki, H. and Hu, C-K, Proc. synp.VLSI Technology, 1996
18. Abe, K., Harada, Y. and Onoda, H., Proc.36th IRPS, pp.342347, 1998
19. Hu, C-K., Lee, K.L., Gupta, D. and Blauner, P., Mat. Res.Soc.Symp. 427, pp95106, 1996 10.1557/PROC-427-95

Texture Control and Electromigration Performance in Al-Based and Cu-Based Layered Interconnects

  • Makiko Kageyama (a1), Kazuhide Abe (a1), Yusuke Harada (a1) and Hiroshi Onoda (a1)

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