Hostname: page-component-848d4c4894-ndmmz Total loading time: 0 Render date: 2024-05-04T02:26:11.874Z Has data issue: false hasContentIssue false
  • English
  • Français

Surface Layer Formation During the Chemical Mechanical Polishing of Copper Thin Films

Published online by Cambridge University Press:  25 February 2011

J.M. Steigerwald ,
S.P. Murarka ,
D.J. Duquette  and
R.J. Gutmann
J.M. Steigerwald
Affiliation:
Rensselaer Polytechnic Institute, Center for Integrated Electronics, Troy, NY 12180
S.P. Murarka
Affiliation:
Rensselaer Polytechnic Institute, Center for Integrated Electronics, Troy, NY 12180
D.J. Duquette
Affiliation:
Rensselaer Polytechnic Institute, Center for Integrated Electronics, Troy, NY 12180
R.J. Gutmann
Affiliation:
Rensselaer Polytechnic Institute, Center for Integrated Electronics, Troy, NY 12180
Get access

Abstract

Three chemical processes that occur during the chemical mechanical polishing (CMP) of copper are described in terms of their effect on surface planarity, polish rate, and corrosion resistance of the polished copper. These processes are surface layer formation, dissolution of mechanically abraded copper, and chemical acceleration of the polish rate. The role of these processes is demonstrated with two slurry formulations used in the CMP of copper at Rensselaer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 337: Symposium B – Advanced Metallization for Devices and Circuits—Science, Technology and Manufacturing III , 1994 , 133
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Miirarka, S.P., Sieigenwald, J., and Gutmann, R J., MRS Bulletin, p 46, June (1993).CrossRefGoogle Scholar
2 Kaufman, F.B., Thompson, D.B., Broadie, R.E., Jaso, M.A., Guthrie, W.L., Pearsons, D.J., and Small, M.B.., J. Electrochem. Soc. 138, p. 3460,(1991).Google Scholar
3 Cohen, S.L., Brusic, V.A., Kaufman, F.B., Frankel, G.S., Motake, S., and, Rush, B., J. Vac. Sci. Tech. A, 8, p. 2417, (1990)Google Scholar
4 Pourbaix, M., Atlas of Electrochemical Equilibria in Aqueous Solutions. NACE, Houston, TX, (1975).Google Scholar
5 Steigerwald, J.M., Murarka, S.P., and Gutmann, R.J., to be published.Google Scholar
6 Johnson, H.E. and Leja, J.. J. Electrochem. Soc. 112, p. 638, (1965).Google Scholar
7 Brusic, V., Frisch, M.A., Eldridge, B.N., Novak, F.P., Kaufman, F.B., Rush, B.M., and Frankel, G.S., J. Electrochem. Soc. 138. p. 2253,(1991).Google Scholar