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Suppression of Dewetting in Pulsed Laser Melting of Thin Metallic Films on SiO2

Published online by Cambridge University Press:  01 February 2011

J. Eric Kline  and
John P. Leonard
J. Eric Kline
Affiliation:
University of Pittsburgh, Department of Materials Science and Engineering. Pittsburgh, PA 15261
John P. Leonard
Affiliation:
University of Pittsburgh, Department of Materials Science and Engineering. Pittsburgh, PA 15261
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Abstract

Pulsed excimer laser projection irradiation has been successfully applied to completely melt and resolidify encapsulated elemental metal films of Au, Cu, Cr, and Ni directly on amorphous SiO2 substrates. A combination of narrow irradiated lines and appropriate SiO2 capping layers was used to obtain films that do not dewet when fully melted. Detailed processing maps were generated for Au and Ni, while equivalent trends for Cu and Cr were also noted. These systems were analyzed for common behaviors, and from these the principle factors, a basic process map is proposed to describe adequately these four systems. Experimental parameters and sample preparation criteria are presented to realize such resolidification studies in other metal systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 854: Symposium U – Stability of Thin Films and Nanostructures , 2004 , U11.6
Copyright
Copyright © Materials Research Society 2005

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References

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