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Substrate Heating Effects in Excimer Laser Planarization of Aluminum

Published online by Cambridge University Press:  21 February 2011

Robert J. Baseman  and
Joseph C. Andreshak
Robert J. Baseman
Affiliation:
IBM Research Division, IBM T.J. Watson Research Center, Yorktown Heights, NY 10598
Joseph C. Andreshak
Affiliation:
IBM Research Division, IBM T.J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

Substantial improvements in excimer laser planarization processes are observed with substrate heating. Cavities, associated with filling of high aspect ratio vias at low substrate temperature, can be eliminated by substrate heating. Damage associated with pulse overlap regions can be temperature sensitive, and is reduced as substrate temperatures areincreased. While required fluences for planarization and sample damage both decrease as the sample temperature increases, the relative insensitivity of the damage threshold generally results in larger process windows at higher temperatures. We also report model calculations of the effect of substrate heating on sample temperature distributions and the durations of the laser driven melts.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 158: Symposium B – In-Situ Patterning: Selective Area Deposition and Etching , 1989 , 267
Copyright
Copyright © Materials Research Society 1990

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References

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