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SU-8 Processing on a Variety of Substrates

  • Yuh-Min Chiang (a1), Mark Bachman (a1), Hung-Pin Chang (a1), Charles Chu (a1) and G. P. Li (a1)...

Abstract

SU-8 has become a popular material for micromachining high aspect ratio structures. Typically, SU-8 is spun on a polished silicon wafer for processing. After patterning, the SU-8 is used for micromachined structures directly (such as fluidic channels) or as a mold for electroforming. Non-silicon substrates offer the possibility of cheaper processing, improved mold designs, and multi-material devices. Successful SU-8 processing depends strongly on surface properties of the substrate itself as well as environmental conditions during the processing. We explore the issues involved in transferring SU-8 technology to non-silicon substrates such as glass, plastics and metals. Issues such as wettability, adhesion, and surface tension are explored in this study. The findings indicate the merits of non-spinning approaches, such as dipping, spraying, and brushing and point to new SU-8 processes.

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References

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1. Lorenz, H., Despont, M., Fahrni, M., LaBianca, N., Vettiger, P., and Renaud, P., “SU-8: a low-cost negative resist for MEMS”, Journal of Micromechanics and Microengineering, 1997 vol.7, p121124.
2. Despont, M., Lorenz, H., Fahrni, M., Brugger, J., Renaud, P., and Vettiger, P., “High aspect ratio ultrathick, negative-tone near-UV photoresist for MEMS applications", Proceedings of MEMS'97, IEEE, 1997, p518522.
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4. Eyre, B., Blosiu, J., and , Wilberg, Dtaguchi Optimization for the Processing of Epon SU-8 Resist", “, Proceedings of MEMS'98, IEEE, 1998, 218222.
5. Wu, S., Polymer Interface and Adhesion, Marcel Dekker, NY (1982), Ch.8.

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