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A Study on the Effect of Post Metal Etching Polymer Strip Process on Via Resistance

Published online by Cambridge University Press:  10 February 2011

Leong-Tee Koh ,
Simon Y. M. Chooi ,
Kho-Liep Chok ,
He-Ming Li  and
Fang-Hong Gn
Leong-Tee Koh
Affiliation:
Deep Submicron Integrated Circuit Department, Institute of Microelectronics, 11 Science Park Road, Singapore Science Park II, Singapore 117685, Singapore
Simon Y. M. Chooi
Affiliation:
Department of Research and Development, Chartered Semiconductor Manufacturing, 60 Woodlands Industrial Park D Street 2, Singapore 738406, Singapore
Kho-Liep Chok
Affiliation:
Department of Research and Development, Chartered Semiconductor Manufacturing, 60 Woodlands Industrial Park D Street 2, Singapore 738406, Singapore
He-Ming Li
Affiliation:
Department of Research and Development, Chartered Semiconductor Manufacturing, 60 Woodlands Industrial Park D Street 2, Singapore 738406, Singapore
Fang-Hong Gn
Affiliation:
Department of Research and Development, Chartered Semiconductor Manufacturing, 60 Woodlands Industrial Park D Street 2, Singapore 738406, Singapore
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Abstract

Corrosion of the titanium glue layer in a Ti/TiN/Al(Cu) /TiN ARC metal stack is observed during post metal etching polymer stripping in an alkaline chemical stripper. This novel corrosion only occurs when the underlying tungsten via plug is exposed, and leads to high resistance in vias. Investigation of the mechanism is attempted through variation of the polymer stripping duration, the deposition of the titanium and the polymer stripper, and the nitridization of the titanium layer. The high via resistance effect is solved by using analternate polymer stripper which is considered to be an inactive electrolyte for the galvanic reaction between the titanium glue layer and the exposed tungsten via.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 564: Symposium N – Advanced Interconnects and Contacts , 1999 , 451
Copyright
Copyright © Materials Research Society 1999

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References

1. For more details on the Semitool Magnum as well as preliminary report on the titanium corrosion, please see: Chooi, S.Y.M., Ismail, Z., Ee, P.Y. and Zhou, M.S., in Multilevel Interconnect Technology II, edited by Graef, M., Patel, D. N., Proceedings of SPIE Volume 3508, SPIE, Bellingham, pp. 181–190 (1998).Google Scholar
2. Chooi, S.Y.M., Ee, P.Y. and Ismail, Z., unpublished work.Google Scholar
3. Menon, S. S. and Choudhury, R.K., in Microelectronic Device and Multilevel Interconnect II, edited by Chen, I.C., Sasaka, N., Patel, D.N. and Dixit, G.A., Proceedings of SPIE Volume 2875, SPIE, Bellingham, pp. 322–328 (1996).Google Scholar
4. Stegemann, K.H., Beyer, C., Heinig, V., Kahlert, V. and Pahner, J., Proceedings of the Fourteenth International VLSI Multilevel Interconnection Conference (VMIC), pp. 491–496 (1997).Google Scholar
5. Bothra, S., Sur, H. and Liang, V., Proceeding of the 36th Annual International Reliability Physics Symposium, IEEE, USA, pp. 150–156 (1998).Google Scholar
6. Bothra, S., Sur, H., Liang, V., Annapragada, R. and Patel, J., Proceedings of the 3rd International Symposium on Plasma Process Induced Damage, American Vacuum Society, New York, pp. 227 (1998).Google Scholar
7. Wranglen, G. in An introduction to Corrosion and Protection of Metals, Stockholm, Institute for Metalskydd, pp. 256 (1972).Google Scholar
8. Lide, David R., CRC Handbook of Chemistry and Physics 73rd edition (1992–1993), pp. 8–21.Google Scholar