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Study of Crack Propagation at an Oxide/Polymer Interface Under Varying Loading Conditions

  • Dtmitrios Panteliidis (a1), Jeffrey Snodgrass (a1), Reinhold H. Dauskardt (a1) and John C. Bravman (a1)

Abstract

We investigate the effect of loading conditions and process parameters on the failure mode of a Silicon/SiO2/Silane/BCB interface system. Chemical analysis of the fracture surfaces with XPS reveals different crack paths through the structure for the two different loading configurations studied. Furthermore, the curing temperature of the silane coupling agent is shown to have a profound impact on the subcritical debond behavior of the structure. A mechanism responsible for this effect is identified and the XPS data is directly correlated to quantitative information about the resistance of the structure to fracture and subcritical crack growth.

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4. Pantelidis, Dimitrios, Lee, Hoo-Jeong and Bravman, John C., “Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications”. Integration of Dissimilar Materials in Micro- and Optoelectronics. Symposium. Held: Boston, MA, USA 30 Nov-1 Dec. 1998, in print.
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Study of Crack Propagation at an Oxide/Polymer Interface Under Varying Loading Conditions

  • Dtmitrios Panteliidis (a1), Jeffrey Snodgrass (a1), Reinhold H. Dauskardt (a1) and John C. Bravman (a1)

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