Hostname: page-component-8448b6f56d-tj2md Total loading time: 0 Render date: 2024-04-23T14:30:33.970Z Has data issue: false hasContentIssue false
  • English
  • Français

A Study of APCVD-Deposited TiO2Characteristics in the Structure of a Tunneling Transistor

Published online by Cambridge University Press:  28 July 2011

A. Behnam ,
B. Hekmatshoar ,
S. Mohajerzadeh ,
B. Arvan ,
F. Karbassian  and
A. Khakifirooz
A. Behnam
Affiliation:
Department of Electrical and Computer Engineering, Thin Film laboratory, University of Tehran, Tehran, Iran, +98-21 801 1235
B. Hekmatshoar
Affiliation:
Department of Electrical and Computer Engineering, Thin Film laboratory, University of Tehran, Tehran, Iran, +98-21 801 1235
S. Mohajerzadeh
Affiliation:
Department of Electrical and Computer Engineering, Thin Film laboratory, University of Tehran, Tehran, Iran, +98-21 801 1235, e-mail: smohajer@vlsi.uwaterloo.ca
B. Arvan
Affiliation:
Department of Electrical and Computer Engineering, Thin Film laboratory, University of Tehran, Tehran, Iran, +98-21 801 1235
F. Karbassian
Affiliation:
Department of Electrical and Computer Engineering, Thin Film laboratory, University of Tehran, Tehran, Iran, +98-21 801 1235
A. Khakifirooz
Affiliation:
Department of Electrical and Computer Engineering, Thin Film laboratory, University of Tehran, Tehran, Iran, +98-21 801 1235
Get access

Abstract

TiO2 and nickel-silicide layers are consequently deposited and micro machined to compose a mesa-structured tunneling transistor. The depositions are done with the RF-sputtering method and the electrical and physical characteristics of the products are investigated. Transistors show an amplification coefficient of about 20. To improve the quality and coverage of the TiO2 layer, the oxide deposition is made by means of an APCVD reactor. The grown oxide shows a dielectric coefficient between 19 and 21 and its breakdown field is about 107 V/cm.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 811: Symposia D/E – Integration of Advanced Micro-and Nanelectronic Devices-Critical Issues and Solutions , 2004 , D3.9
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Hobbs, C., Hegde, R. and Maiti, B., Symposium on VLSI Technology Digest of Technical Papers, pp.133–135 (1999).Google Scholar
[2] Aarik, J., Aidla, A. and Mandar, H., Appl. Surf. Sci., Vol.172, pp.148–158 (2001).Google Scholar
[3] Aarik, J., Aidla, A. and isler, A.A. Ki, Thin Solid Films, Vol.305, pp.270–273 (1997).Google Scholar
[4] Kim, B., Byun, D. and Kee Lee, J., Japanese Journal of the Applied Physics, Vol.41, Part. 1, No.1, pp.222–226 (2002).Google Scholar
[5] Tahara, S., et al. , Japanese Journal of the Magnetic, Vol.27, pp.167–171 (2003).Google Scholar
[6] Seabaugh, A., Integration Workshop, Dec. (1999).Google Scholar
[7] Pacha, C., et al. , 24th European Solid-State Circuits Conference, Sep. (1998).Google Scholar
[8] Majkusiak, B., IEEE Transactions on Electron Devices, Vol.45, No.9, Sep. (1998).Google Scholar
[9] Taniyama, H., IEEE Transactions on Electron Devices, Vol.41, No.3, Mar. (1994).Google Scholar
[10] Otto, A., Europhysics Letters, Vol.62, No.3, pp.398–404 (2003).Google Scholar
[11] Grekhov, I.V., Cryogenics, Vol.38, No.6 (1998).Google Scholar