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Stress-Corrosion Cracking of Spin-on Glass Thin Films

  • Robert F Cook (a1) and Eric G Liniger (a1)

Abstract

The crack-velocity behavior of silsesqioxane spin-on glass thin films exposed to moist environments is examined. An absolute reaction-rate model is used to predict crack velocity using a deleted-bond model and fused silica as a basis, and compared with observed steady-state crack velocities as a function of film thickness and variations in the curing process. An implication is that, on curing, the driving force for film fracture, determined by thermal expansion mismatch, increases less rapidly than the fracture resistance, determined by polymerization.

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2. Miller, R. D. Hedrick, J. L., Yoon, D. Y. Cook, R. F. and Hummel, J. P., MIS Bulletin 22, p. 44 (1997).
3. Cook, R. F. Liniger, E. G. Klaus, D. P. Simonyi, E. E. and Cohen, S. A. in Low Dielectric Constant Materials and Applications in Microelectronics IV (this volume).
4. Wiederhorn, S. M. and Bolz, L. H. J. Am. Ceram. Soc. 53, p. 543 (1970).
5. Cook, R. F. and Liniger, E. G. J. Amer. Cer. Soc. 76, p. 10 96 (1993).
6. Cook, R.F. Mater. Sci. Eng., in press (1998)

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Stress-Corrosion Cracking of Spin-on Glass Thin Films

  • Robert F Cook (a1) and Eric G Liniger (a1)

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