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Stress and its Effect on Surface Morphology in Multi-Layer Ti-Cu Films

Published online by Cambridge University Press:  10 February 2011

Ping Zhou ,
Saps Buchman ,
Chris Gray ,
John Turneaure  and
James E. Turlo
Ping Zhou
Affiliation:
W.W. Hansen Experimental Physics Laboratory, Stanford University, Stanford, CA 94305, USA
Saps Buchman
Affiliation:
W.W. Hansen Experimental Physics Laboratory, Stanford University, Stanford, CA 94305, USA
Chris Gray
Affiliation:
W.W. Hansen Experimental Physics Laboratory, Stanford University, Stanford, CA 94305, USA
John Turneaure
Affiliation:
W.W. Hansen Experimental Physics Laboratory, Stanford University, Stanford, CA 94305, USA
James E. Turlo
Affiliation:
Tencor Metrology, Tencor Instruments, Santa Clara, CA 95054, USA
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Abstract

We have characterized the stress and its effects on surface morphology for multi-layer thin films of about 3μm total thickness, consisting of three or seven layers of Ti and Cu. These films constitute the electrostatic suspension electrodes for the gyroscope housings of the Relativity Mission Gravity Probe B. Full understanding of surface morphology is critical for meeting the complex requirements of this application.

The residual stresses have been measured using a laser curvature technique, while the surface morphology was studied by scanning electron microscopy (SEM). We find that the surface morphology depends strongly on the stress, which evolves with the Ti-Cu multi-layer period. Average stress and the resulting surface roughness decrease for thinner Cu layers (increased total number of layers). Seven layer Ti-Cu films with low stress and very smooth surface have been successfully used for the electrodes of the gyroscope housings.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 441: Thin Films – Structure and Morphology , 1996 , 433
Copyright
Copyright © Materials Research Society 1997

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References

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