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STM investigation of energetic insertion during direct ion deposition

  • Joshua M. Pomeroy (a1), Aaron Couture (a2), Joachim Jacobsen (a1), Barbara H. Cooper (a3), J.P. Sethna (a2) and Joel D. Brock (a2)...

Abstract

Thin copper films have been deposited on single crystal copper substrates and characterized using a UHV Scanning Tunneling Microscope to probe the effect of atomic insertions during hyperthermal ion deposition. At low temperatures, atomic insertions are predicted to provide a net downhill current that offsets the roughening effect due to uphill “Schwoebel” currents leading to a net smoothing of the surface. Films have been grown at several different energies targeted to observe a crossover from insertion driven smoothing to adatom-vacancy dominated roughening. Copper thin films are deposited near 20 eV using a mass selected ion deposition system that allows precise control (+/− 2 eV) over the energy of constituent atoms. Experimental observations are compared with a sophisticated Kinetic Monte Carlo and Molecular Dynamics hybrid (KMC-MD) simulation.

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STM investigation of energetic insertion during direct ion deposition

  • Joshua M. Pomeroy (a1), Aaron Couture (a2), Joachim Jacobsen (a1), Barbara H. Cooper (a3), J.P. Sethna (a2) and Joel D. Brock (a2)...

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