Hostname: page-component-8448b6f56d-42gr6 Total loading time: 0 Render date: 2024-04-19T14:11:16.740Z Has data issue: false hasContentIssue false

Solid-Phase Crystallization of Amorphous Si0.7Ge0.3/Si and Si/Si0.7Ge0.3 Bilayer Films on SiO2

Published online by Cambridge University Press:  10 February 2011

Tae-Hoon Kim
Affiliation:
Division of Material Science & Engineering, Seoul National University, Seoul, Korea 151-742
Myung-Kwan Ryu
Affiliation:
Division of Material Science & Engineering, Seoul National University, Seoul, Korea 151-742
Jin-Won Kim
Affiliation:
Division of Material Science & Engineering, Seoul National University, Seoul, Korea 151-742
Chang-Soo Kim
Affiliation:
Afaterials Evaluation Center, Korea Research Institute of Standards Science, Chungnam, Korea, 305-606
Ki-Bum Kim
Affiliation:
Division of Material Science & Engineering, Seoul National University, Seoul, Korea 151-742
Get access

Abstract

We have investigated the solid phase crystallization of a-(Si/Si0.7Ge0.3) and a-(Si0.7Ge0.3/Si) bilayer films deposited on SiO2 for an annealing temperature of 550 °C. It was found that, in case of a-(Si0.7Ge0 3/Si), nucleation of crystalline phases occurred at the free surface, while in a-(Si/Si0.7Ge0.3) crystalline phase nucleated at Si0.7Ge0.3/SiO2 interface. The crystallization rate of an a-(Si0.7Ge0.3/Si) is much slower than that of an a-(Si/Si0.7Ge0.3) films. After full crystallization, poly-(Si0.7Ge0.3/Si) has many equiaxed grains and the defect density of the upper Si0.7Ge0.3 was much lower than that of lower Si0.7 Ge0.3 in a poly-(Si/Si0.7Ge0.3) film whose grain morphology was elliptical. The average grain size of poly-(Si0.7Ge0.3/Si) was ˜7 μm and this film had strong (111) preferential orientation, while poly-(Si/Si0.7Ge0.3) had weak (311) or random oriented grains with the average size of˜0.3 μm.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. King, T.-J., Pfiester, J. R., and Saraswat, K. C., IEEE Electron Dev. Lett. EDL–12, 584 (1991).Google Scholar
2. Hwang, C. W., Ryu, M. K., Kimn, K. B., Lee, S. C., and Kim, C. S., J. Appl. Phys. 77, 3042 (1995).Google Scholar
3. Tang, A. J., Tsai, J. A., Reif, R, and King, T.-J, IEDM 95, 513 (1995).Google Scholar
4. Ryu, M. K., Kim, J. W., Kim, T. H, Kim, K. B., Hwang, C. W., Jpn. J. Appl. Phys. 34, L1031 (1995).Google Scholar
5. Kim, J. W., Ryu, M. K., Kim, K. B., Kim, S. J., J. Electrochem. Soc. 143, 363 (1996).Google Scholar
6. Hamilton, D. R. and Seidensticker, R. G., J. Appl. Phys. 31, 1165 (1960).Google Scholar
7. Drosd, R. and Washburn, J., J. Appl. Phys. 53, 397 (1982).Google Scholar
8. Nakamura, A., Emoto, F., Fujii, E., Yamamoto, A., Uemoto, Y., Senda, K., and Kano, G., J. Appl. Phys. 66, 4248 (1989).Google Scholar
9. Sakai, A., Ono, H., Ishida, K., Nini, T., and Tatsumi, T., Jpn. J. Appl. Phys. 30, L941 (1991).Google Scholar