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Sol–Gel-Derived 0–3 Composite Materials for Direct Write Electronics Applications

Published online by Cambridge University Press:  10 February 2011

Steven M. Coleman ,
Robert L. Parkhill ,
Robert M. Taylor  and
Edward T. Knobbe
Steven M. Coleman
Affiliation:
Thin Film and Materials Processing Group, Department of Chemistry, Oklahoma State University, Stillwater, OK, U.S.A., 74078 CMS Technetronics, Inc., 5202-2 North Richmond Hill Road, Stillwater, OK, U.S.A., 74075
Robert L. Parkhill
Affiliation:
CMS Technetronics, Inc., 5202-2 North Richmond Hill Road, Stillwater, OK, U.S.A., 74075
Robert M. Taylor
Affiliation:
CMS Technetronics, Inc., 5202-2 North Richmond Hill Road, Stillwater, OK, U.S.A., 74075
Edward T. Knobbe
Affiliation:
Thin Film and Materials Processing Group, Department of Chemistry, Oklahoma State University, Stillwater, OK, U.S.A., 74078
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Abstract

The use of sol–gel-derived 0–3 composite ceramics for low-temperature direct-write electronics applications was investigated. The 0–3 composite paste materials were prepared using selected metal alkoxides and commercial low- and high-κ' dielectric powders. The composite pastes were deposited onto alumina and polyimide substrates using conventional screening and micro-dispensing techniques. The deposited films were oven-dried at or below 200°C and thermally densified using a CO2 laser. The 0–3 composites exhibited good adhesion and structural density. Electrical characterization of the laser-processed dielectrics revealed κ' values as high as 295 and tan δ as low as 0.02 on polyimide substrates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 624: Symposium V – Materials Development for Direct Write Technologies , 2000 , 53
Copyright
Copyright © Materials Research Society 2000

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References

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