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Simple Computer Modeling of the Grain Microstructure of Al-4wt%Cu Interconnection Lines

  • K.S. Low (a1), S.J. Bull (a2) and A.G. O'Neill (a1)

Abstract

A simple computer model is proposed to simulate the microstructural evolution of Al-4wt%Cu lines. The model includes the coarsening and pinning of Al2Cu precipitates which occur during normal grain growth. This model is used to explore how Cu-rich precipitates evolve during normal grain growth, and how they affect the evolution of grain structure from polycrystalline to bamboo.

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Simple Computer Modeling of the Grain Microstructure of Al-4wt%Cu Interconnection Lines

  • K.S. Low (a1), S.J. Bull (a2) and A.G. O'Neill (a1)

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