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SiGe RF - Electronic: Devices, Circuits, Competitors, Markets

Published online by Cambridge University Press:  10 February 2011

U. König*
Affiliation:
Daimler-Benz AG, Research Center Ulm, D-89081 Ulm, Germany
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Abstract

The outstanding performance of the SiGe/Si heterosystem and its compatibility to the dominating Si-technology, opens perspectives for a new generation of high volume microelectronic components, just for communication markets. This paper reviews device and circuit results from experiments and simulations for SiGe HBTs and for SiGe HFETs, and compares those to device results made from competitive materials. Figures of merit considered are gains, transconductances, frequencies, noise, power, delays and bandwidths.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

/1/ Kasper, E., Kibbel, H., Schäffler, F., J. Electrochem. Soc., 136, 4, 1154 (1989)Google Scholar
/2/ LPCVD Centura, Applied Material TechnologyGoogle Scholar
/3/ Meyerson, B.S., Solid State Technology 53, Feb. (1994)Google Scholar
/4/ SiGe Microsystems Inc., http://www.sige.comGoogle Scholar
/5/ Dambkes, H., Herzog, H.J., Jorke, H., Kibbel, H. and Kasper, E., IEDM 85, 768 (1985)Google Scholar
/6/ Pearsall, T.P., Bean, J.C., People, R. et al. Proc. l Int. Symp. Si-MBE, 400 (1985)Google Scholar
/7/ Glück, M., Hackbarth, T., König, U., Birk, M., Haas, A., Kohn, E., Proc. MSS 8. July 1997, St. BarbaraGoogle Scholar
/8/ Arafa, M., Ismail, K., Chu, J.O., Meyerson, B.S. and Adesida, I., IEEE-EDL 17, 586 (1996)Google Scholar
/9/ Patton, G.L., Iyer, S.S., Delage, S.L., Tiwari, S. et al. , IEEE-EDL 9, 165 (1988)Google Scholar
/10/ Oda, K., Ohne, E., Tanabe, M., Shimamoto, H., Onai, T., Washio, K., IEDM Techn. Digest (1997)Google Scholar
/11/ Schsüppen, A., Erben, U., Gruhle, A. et al. IEDM 95, 743 (1995)Google Scholar
/12/ Gruhle, A., Schüppen, A., Kibbel, H. and König, U., Proc. Int. Symp. Comp. Semic. (1995)Google Scholar
/13/ Kasper, E., Kibbel, H. and König, U., MRS Symp. Proc. 220, 451 (1991)Google Scholar
/14/ Schreiber, H.U. and Bosch, B.G., IEDM 89, 643 (1989)Google Scholar
/15/ Gruhle, A., Kibbel, H., König, U. et al. , IEEE-EDL 13, 206 (1992)Google Scholar
/16/ Schüppen, A., Dietrich, H., Gerlach, S. et al. , IEEE-BCTM 8.2, 130 (1996)Google Scholar
/17/ König, U., Gruhle, A. and Schüppen, A., IEEE GaAs-IC Symp. 14 (1995)Google Scholar
/18/ Schüppen, A., Gruhle, A., Kibbel, H., Erben, U. and König, U., Electron. Lett 30, 1187 (1994)Google Scholar
/19/ Mähner, C., Gruhle, A., Electronic Letters, 33, 24, 2050 (1997)Google Scholar
/20/ Schumacher, H., Erben, U. and Gruhle, A. SOTOPOCS XVIII (1993)Google Scholar
/21/ Kermarrec, C., Tewksbury, T., Dawe, G. et al. , IEEE-BCTM, 155 (1994)Google Scholar
/22/ Schüppen, A., Gerlach, S., Dietrich, H. et al. , IEEE Microw. Lett. 6, 341 (1996)Google Scholar
/23/ Pruijmboom, A., Terpstra, D., Timmering, C.E. et al. IEDM 95, 747 (1995)Google Scholar
/24/ Meister, T.F., Schäfer, H., Franosch, M. et al. , IEDM 95, 739 (1995)Google Scholar
/25/ Sato, F. et al. , IEEE-BCTM, 82 (1995)Google Scholar
/26/ Heinemann, B., Knoll, D., Fischer, G. et al. , ESSDERC (1997)Google Scholar
/27/ Nelson, S.F., Ismail, K. et al. , Appl. Phys. Lett. 63, 367 (1993)Google Scholar
/28/ König, U. and Schäffler, F., SSDM, 201 (1993)Google Scholar
/29/ Hagelauer, R., Ostermann, T. et al. , Electron. Letters 33, 208 S(1997)Google Scholar
/30/ Ismail, K., Meyerson, B.S., Rishton, S., Chu, J. et al. IEEE-EDL 13, 229 (1992)Google Scholar
/31/ König, U., Glöck, M., Höck, G., Proc. Silicon Heterostructures from Phys. to Devices, Engineering Foundation, Barga Italy (Sept. 1997)Google Scholar
/32/ GlUck, M., Hackbarth, T., König, U. et al. , Electron Lett. 33, 335 (1997)Google Scholar
/33/ Ismail, K., IEDM 95, 509 (1995)Google Scholar
/34/ König, U., Physica Scnipta T 68, 90 (1996)Google Scholar
/35/ see Bechtel, G., chairman at IEEE GaAs IC Symp. (1995)Google Scholar
/36/ Schüppen, A., Dietrich, H., Arndt, J., unpublishedGoogle Scholar
/37/ Harame, D.L., Stork, J.M.C. et al. , IEDM 93, 71 (1993)Google Scholar
/38/ Suzaki, T., Proc. Ultrafast Elec. and Optoel. Conf., 91 (1995)Google Scholar
/39/ Geppert, W. and Schreiber, H.U., Electron. Lett. 33, 447 (1996)Google Scholar
/40/ Schumacher, H., Gruhle, A., Erben, U. et al. , IEEE-BCTM (1995)Google Scholar
/41/ IEEE-BCTM 1996 various papersGoogle Scholar
/42/ Gruhle, A., Schüppen, A. et al. , IEDM 95, 725 (1995)Google Scholar
/43/ Schumacher, H. et al. unpublishedGoogle Scholar
/44/ Wurzer, M., Meister, T.F. et al. , IEEE Int. Sol. State Circ. Conf., 122 (1997)Google Scholar
/45/ Felder, A., Möller, M., Wurzer, M., Rest, M., Meister, T.F., Rein, H.M., Electr. Letters 33, 1984(1997)Google Scholar
/46/ Dtirr, W., Menzel, W. and Schumacher, H., IEEE Microw. Lett. 7, 63 (1997)Google Scholar
/47/ Gruhle, A., Kibbel, H. and Speck, R., Proc. EU MC-Conf. 648 (1994)Google Scholar
/48/ van Haaren, B., Regis, M., Llopis, O., Escotte, L., A. Gruhle et.al., 28th Conf. European Microwave (1998)Google Scholar
/49/ Ostermann, T., Glück, M., Hagelauer, R. et al. , Proc. Int. Semicond. Device Research Symposium (Dec. 1997)Google Scholar
/50/ Saxarra, M., Glück, M., Albers, J.N. et al. , Electron. Letters 34, 4, 499 (1998)Google Scholar
/51/ König, U. and Dämbkes, H., Sol. State Electron. 38, 1595 (1995)Google Scholar
/52/ Mii, Y., Rishton, S., Taur, Y., Kern, D. et al. , IEEE-EDL 15, 28 (1994)Google Scholar
/53/ Momose, H. S., Nakamura, S., Katsumata, Y. et al. ESSDERC, 133 (1997)Google Scholar
/54/ deduced from various market studies, e.g. Alcatel, Dasa, Daimler-Benz, ESA, TemicGoogle Scholar