Hostname: page-component-848d4c4894-xfwgj Total loading time: 0 Render date: 2024-06-23T18:09:58.887Z Has data issue: false hasContentIssue false

SiGe Heterojunctions Transistors and Optoelectronic Devices

Published online by Cambridge University Press:  25 February 2011

Maurizio Arienzo
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
James H. Comfort
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Emmanuel F. Crabbe
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
David L. Harame
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Subramanian S. Iyer
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Vijay P. Kesan
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Bernard S. Meyerson
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Gary L. Patton
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Johannes M.C. Stork
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Yuan-Chen Sun
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Get access

Abstract

SiGe alloys have been successfully applied to a number of semiconductor devices, including bipolar heterojunction transistors, field effect transistors (FET's), and optoelectronic devices and structures. This review paper will first summarize the results obtained to-date in bipolar transistors, highlighting the design flexibility and the trade-offs offered by SiGe heterojunction technology and bandgap engineering, like junction field/capacitance control, liquid nitrogen operation and complementary processes. The leverage of this technology in high speed circuits will be discussed, including the record 75 GHz fr and 60 GHz fmax heterojunction bipolar transistors, the achievement of sub-25 ps ECL ring oscillator delay, and the doubling of the mobility in p-MODFETs. The applications of this technology to optoelectronic devices, including detectors and waveguides, will also be reviewed, to extend the use of silicon technology to long wavelength communication technology and infrared imaging.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Meyerson, B.S., in: Appl. Phys. Lett. vol. 48, (1986) 797799.Google Scholar
[2] Meyerson, B. S., Ganin, E., Smith, D. A., and Nguyen, T. N., in: J. Electrochem. Soc. vol. 133, (1986) 1232.Google Scholar
[3] Iyer, S.S., Patton, G.L., Stork, J.M.C., Meyerson, B.S., and Harame, D.L., in: IEEE Trans. Electron. Dev. vol. 36, (1989) 20432064.Google Scholar
[4] Arienzo, M., Iyer, S.S., Meyerson, B.S., Patton, G.L., and Stork, J.M.C., in: Appl. Surface Sci. vol. 48/49, (1991) 377386.Google Scholar
[5] Kasper, E. and Parker, E.H.C. (eds), in: Thin Solid Films vol. 183 (12), (1989)Google Scholar
[6] Patton, G., Harame, D.L., Stork, J.M.C., Meyerson, B.S., Scilla, G.J., and Ganin, E., in: IEEE Electron Devices Letters vol. EDL–11, (1990) 171173.Google Scholar
[7] Comfort, J., Patton, G.L., Cressler, J.D., Lee, W., Crabbe, E.F., Meyerson, B.S., Sun, J.Y.-C., Stork, J.M.C., Lu, P.-F., Burghartz, J.N., Warnock, J., Scilla, G., Toh, K.-Y., D'Agostino, M., Stanis, C., and Jenkins, K., in: IEDM Tech. Dig. (1990) 21.Google Scholar
[8] Comfort, J.H., Crabbe, E.F., Cressler, J.D., Lee, Y., Sun, J‥Y.-C., Malinowski, J., D'Agostino, M., Burghartz, J.N., Stork, J.M.C., and Meyerson, B.S., in: IEDM Tech. Dig. (1991) 857860.Google Scholar
[9] Crabbe, E.F., Comfort, J.H., Lee, Y., Cressler, J.D., Meyerson, B.S., Sun, J.Y.-C., and Stork, J.M.C., in: IEEE Electron Device Letters vol. EDL–13, (1992) 259261.Google Scholar
[10] Pruijmboom, A., Slotbloom, J.W., Gravesteijn, D.J., Fredriksz, C.W., van Gorkum, A.A., van de Heuvel, R.E., van Rooij-Mulder, J.M.L., Streutker, G., and van de Walle, G.F.A., in: IEEE Electron Device Letters vol. EDL–12, (1991) 357359.Google Scholar
[11] van Gorkum, A.A., van de Walle, G.F.A., Gravesteijn, D.J., Pruijmboom, A., Mishima, T., and van de Heide, P.A.M., in: Proc. 1st Topical Symp. on Siliocn-Based Heterostructures (1991)Google Scholar
[12] Gruhle, A., Kibbel, H., Konig, U., Erben, U., and Kasper, E., in: IEEE Electron Device Letters vol. EDL–13, (1992) 206208.Google Scholar
[13] Gruhle, A., Kibbel, H., and Kasper, E., in: Proc. Dev. Res. Conference (1992)Google Scholar
[14] Gruhle, A., in: Proc. 39th Symp. American Vacuum Society (1992)Google Scholar
[15] Patton, G., Stork, J.M.C., Comfort, J., Crabbe, E.F., Meyerson, B.S., Harame, D., and Sun, J.Y.-C., in: IEDM Tech. Dig. (1990) 13.Google Scholar
[16] Tang, D.D. and Lu, P.-F., in: IEEE Electron Devices Letters vol. EDL–10, (1989) 67.Google Scholar
[17] Crabbe, E., Patton, G.L., Stork, J.M.C., Comfort, J., Meyerson, B.S., and Sun, J.Y.-C., in: IEDM Tech. Dig. (1990) 17.Google Scholar
[18] Cressler, J., Comfort, J., Crabbe, E.F., Patton, G.L., Lee, W., Sun, J‥Y.-C., Stork, J.M.C., and Meyerson, B.S., in: IEEE Electron Devices Letters vol. EDL–12, (1991) 166.Google Scholar
[19] Harame, D.L., Stork, J.M.C., Meyerson, B.S., Crabbe, E.F., Scilla, G.L., de Fresart, E., Megdanis, A.E., Stanis, C.L., Patton, G.L., Comfort, J.H., Bright, A.A., Johnson, J.B., and Furkay, S.S., in: IEDM Tech. Dig. (1990) 3336.Google Scholar
[20] Harame, D.L., Meyerson, B.S., Crabbe, E.F., Stanis, C.L., Cotte, J.M., Stork, J.M.C., Megdanis, A.E., Patton, G.L., Stifller, S.R., Johnson, J.B., Warnock, J.D., Comfort, J.H., and Sun, J‥Y.-C., in: 1991 Symposium on VLSI Technology Technical Digest (1991) 7172.Google Scholar
[21] Chuang, C.T. and Tang, D.D., in: 1991 Symposium on VLSI Circuits Technical Digest (1991) 117118.Google Scholar
[22] Daembkes, H., Herzog, H.-.I., Jorge, H., Kibble, H., and Kasper, E., in: IEDM Tech. Digest (1985) 768770.Google Scholar
[23] Pearsall, T.P. and Bean, J.C., in: IEEE Electron Device Letters vol. EDL–7, (1986) 308310.Google Scholar
[24] Schafller, R., Tobben, D., Herzog, H-J, Abstreiter, G., and Hollander, B., in: Semicon. Sci. Technol. vol. 7, (1992) 260266.Google Scholar
[25] Ismail, K., Meyerson, B.S., Rishton, S., Chu, J., Nelson, S., and Nocera, J., in: IEEE Electron Device Letters vol. EDL–13, (1992) 229231.Google Scholar
[26] Subanna, S., Kesan, V.P., Tejwani, M., Restle, P.J., Mis, D.J., and Iyer, S.S., in: 1991 Symposium on VLSI Technology Technical Digest (1991) 103104.Google Scholar
[27] Verdonckt-Vandebroek, S., Crabbe, E.F., Meyerson, B.S., Harame, D.L., Restle, P.J., Stork, J.M.C., Megdanis, A.E., Stanis, C.L., Bright, A.A., Kroesen, G.M.W., and Warren, A.C., in: 1991 Symposium on VLSI Technology Technical Digest (1991) 105106.Google Scholar
[28] Patton, G.L., Iyer, S.S., Delage, S.L., Ganin, E., and Mcintosh, R.C., in: Mat. Res. Soc. Symp. Proc. vol. 102, (1988) 295299.Google Scholar
[29] Iyer, S.S., Solomon, P.M., Kesan, V.P., Bright, A.A., Freeouf, J.L., Nguyen, T.N., and Warren, A.C., in: IEEE Electron Device Letters vol. 12, (1991) 244245.Google Scholar
[30] Kesan, V.P., Subbanna, S., Restle, P.J., Tejwani, M.J., Aitken, J.M., Iyer, S.S., and Ott, J.A., in: IEDM Technical Digest (1991) 2528.Google Scholar
[31] Lang, D.V., People, R., Bean, J.C., and Sergent, A.M., in: Appl. Phys. Lett. vol. 47, (1985) 13331335.Google Scholar
[32] Temkin, H., Pearsall, T.P., Bean, J.C., Logan, R.A., and Luryi, S., in: Appl. Phys. Lett. vol. 48, (1986) 963965.Google Scholar
[33] Pearsall, T.P., Temkin, H., Bean, J.C., and Luryi, S., in: IEEE Electon Device Letters vol. EDL–7, (1986) 330332.Google Scholar
[34] Kesan, V.P., May, P.G., Bassous, E., and Iyer, S.S., in: IEDM Tech. Dig. (1990) 637640.Google Scholar
[35] George, T., Jones, E.W., Ksendzov, A., and Huberman, M.L., in: Appl. Phys. Lett., vol. 60,(1992) 380382.Google Scholar
[36] Chen, C.K. and Marino, S.A., in: IEEE Elect. Dev. Lett., vol. 12, (1991) 293295.Google Scholar
[37] Karunasiri, R.P.G. and Wang, K.L., in: Appl. Phys. Lett., vol. 60, (1992) 103105.Google Scholar
[38] Splett, A., Schmidtchen, J., Schuppert, B., Petermann, K., Kasper, E., and Kibbel, H., in: Elect. Lett., vol. 27, (1991) 14861488.Google Scholar
[39] Pesarcik, S.F., Treyz, G.V., Iyer, S.S., and Halbout, J.-M., in: Elect. Lett., vol. 28, (1992) 159160.Google Scholar