Skip to main content Accessibility help
×
Home

Selective Electroless Copper Metallisation of Epoxy Substrates

  • L. M. Campion (a1), M. O'reilly (a1), D. J. Macauley (a1), P. V. Kelly (a1) and G. M. Crean (a1)...

Abstract

This paper discusses the development of a novel selective electroless copper metallisation route for the plating of epoxy substrates. This has the potential for the development of a more cost effective and environmentally friendly plating process than currently available technologies. The electroless process required that the electrically insulating epoxy substrate was initially activated to catalyse the reduction of the copper (I1) salt which was in solution to a copper (0) deposit. Selective activation was achieved by coating the epoxy substrates with a new proprietary palladium compound and selectively exposing specific areas to 222nm radiation from a KrCI* excimer lamp. It has been shown that only the palladium metal and not the proprietary precursor catalyse the reaction. After selective seeding the patterned epoxy substrates were copper plated in a commercial electroless copper bath. The process conditions and effect of surface preparation on the quality and resolution of the selectively deposited copper patterns are discussed.

Copyright

References

Hide All
[ 1] Garrou, P., ‘Polymer Dielectrics for Multichip Module Packaging’, Proceedings of IEEE, 80, (1992),.
[2] Garrou, P., ‘Thin film interconnection Technology Boosts MCM Performance’, Electronic Packaging & Production, Oct (1992) pp 44–47.
[3] Farage, A. et al., ‘Manufacturing studies of BCB as the Interlevel Dielectric Material for multilevel Interconnect MCM and VLSI Applications’, ISI-M Proceedings, San Francisco, Oct, (1992) pp 596600.
[4] Gross, et al, J. AppI. Phys. Lett. 60 (1992) 1628.
[5] DeSilva, M.J. and Pedraza, A.J., J. Mater. Res., 9, 4, (Apr 1994) pp 10191026.
[6] Yoon-Gi, Kim et al., J. Micromech. Microeng. 1, 4245, (1991).
[7] Esrom, H., Demny, J. and Kogelschatz, U., Chemtronics, 4, (Sept 1989) pp 202208.
[8] Mcauley, D.J., Kelly, P.V., Crean, G.M., ‘Ultraviolet Excimer Lamp Photoassisted Selective Palladium Activation of Coarse and Fine Grain Alumina Ceramic for Selective Electroless Copper Plating’, MRS Fall Meeting, Symposium J, (Dec 1996).

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 0 *
Loading metrics...

Abstract views

Total abstract views: 0 *
Loading metrics...

* Views captured on Cambridge Core between <date>. This data will be updated every 24 hours.

Usage data cannot currently be displayed