- Cited by 33
Ballarini, R. 1998. Recent Developments in Experimental and Theoretical Studies of The Mechanical Behavior of Polycrystalline Silicon for Microelectromechanical Systems. MRS Proceedings, Vol. 546, Issue. ,
Last, Howard R. Hemker, Kevin J. and Witt, Ronald 1999. MEMS Material Microstructure and Elastic Property Modeling. MRS Proceedings, Vol. 605, Issue. ,
LaVan, D.A. Hohlfelder, R.J. Sullivan, J.P. Friedmann, T.A. Mitchell, M. and Ashby, C.I.H. 1999. Tensile Properties of Amorphous Diamond Films. MRS Proceedings, Vol. 594, Issue. ,
Spearing, S.M 2000. Materials issues in microelectromechanical systems (MEMS). Acta Materialia, Vol. 48, Issue. 1, p. 179.
Qin, Ming Poon, M.C and Yuen, C.Y 2000. A study of nickel silicide film as a mechanical material. Sensors and Actuators A: Physical, Vol. 87, Issue. 1-2, p. 90.
Knauss, Wolfgang G. 2000. Perspectives in experimental solid mechanics. International Journal of Solids and Structures, Vol. 37, Issue. 1-2, p. 251.
Ming Qin Yuen, C.Y. Poon, M.C. and Chan, W.Y. 2000. Measurement of Young's modulus of nickel silicide film by a surface profiler. p. 64.
Tada, Haruna Kumpel, Amy E. Lathrop, Richard E. Slanina, John B. Nieva, Patricia Zavracky, Paul Miaoulis, Ioannis N. and Wong, Peter Y. 2000. Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures. Journal of Applied Physics, Vol. 87, Issue. 9, p. 4189.
Allen, A. M. and Johnson, G. C. 2000. Resonating Microelectromechanical Structures for Metrology. MRS Proceedings, Vol. 657, Issue. ,
Stephens, L.S. Kelly, K.W. Simhadri, S. McCandless, A.B. and Meletis, E.I. 2001. Mechanical property evaluation and failure analysis of cantilevered LIGA nickel microposts. Journal of Microelectromechanical Systems, Vol. 10, Issue. 3, p. 347.
Jensen, B.D. de Boer, M.P. Masters, N.D. Bitsie, F. and LaVan, D.A. 2001. Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS. Journal of Microelectromechanical Systems, Vol. 10, Issue. 3, p. 336.
Chasiotis, Ioannis and Knauss, Wolfgang G. 2002. A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy. Experimental Mechanics, Vol. 42, Issue. 1, p. 51.
Kompella, M.K and Lambros, J 2002. Micromechanical characterization of cellulose fibers. Polymer Testing, Vol. 21, Issue. 5, p. 523.
Bagdahn, J. Sharpe, W.N. and Jadaan, O. 2003. Fracture strength of polysilicon at stress concentrations. Journal of Microelectromechanical Systems, Vol. 12, Issue. 3, p. 302.
Cambie, R. Carli, F. and Combi, C. 2003. Evaluation of mechanical properties by electrostatic loading of polycrystalline silicon beams. p. 3.
Chasiotis, I. and Knauss, W.G. 2003. Comprehensive Structural Integrity. p. 41.
Espinosa, H.D Prorok, B.C and Fischer, M 2003. A methodology for determining mechanical properties of freestanding thin films and MEMS materials. Journal of the Mechanics and Physics of Solids, Vol. 51, Issue. 1, p. 47.
McElhaney, Kevin W and Ma, Qing 2004. Investigation of moisture-assisted fracture in SiO2 films using a channel cracking technique. Acta Materialia, Vol. 52, Issue. 12, p. 3621.
Chasiotis, I. 2004. Mechanics of Thin Films and Microdevices. IEEE Transactions on Device and Materials Reliability, Vol. 4, Issue. 2, p. 176.
Chasiotis, Ioannis 2004. Micromechanics and Nanoscale Effects. Vol. 10, Issue. , p. 3.
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The Young's modulus and strength of polysilicon specimens manufactured in the same production run were measured in four different laboratories. Specimens subjected to in-plane bending were tested at U. C. Berkeley and at Failure Analysis Associates, and tensile measurements were made at Caltech and Johns Hopkins. All specimens were produced at the Microelectronics Center of North Carolina (MCNC).
In bending, the Young's modulus for specimens nominally 2 µm thick was measured as 174 GPa and 137 GPa; whereas in tension, a value of 132 GPa was obtained. Modulus values of 136 GPa and 142 GPa were measured in tension on specimens nominally 1.5 µm and 3.5 µm thick. Strengths of the brittle polysilicon were 2.8 and 2.7 GPa in bending and 1.3 GPa for both thicknesses in tension.
These preliminary results were presented at Symposium N - Microelectromechanical Structures for Materials Research at the Materials Research Society meeting in April 1998. This paper is a short overview of the test methods — each of which is described elsewhere — and a documentation of the results presented at that time.
Hide All1 ASTM Committee E-1 1 on Quality Control of Materials, “ASTM Manual for Conducting an Interlaboratory Study of a Test Method”, ASTM STP 335, (1963).2 Newman, J. C. Jr., and Edwards, P. R., “Short-Crack Growth Behaviour in an Aluminum Alloy - an AGARD Cooperative Test Programme”, AGARD Report No. 372, (1988).3 Legros, M., Kumar, S., Jayaraman, S., Hemker, K. J., and Sharpe, W. N. Jr., “Microstructural Observations of LPCVD Double Layer Polysilicon Thin Film Tensile Specimens,” Polycrystalline Thin Films, MRS Symposium Proceedings, 472, pp. 275–280, (1997).4 Gupta, R. K., Osterberg, P. M., and Senturia, S. D.,”Material Properties Measurements of Micromechanical Polysilicon Beams”, Microlithography and Metrology in Micromachining 11, SPIE Vol. 2880, Austin, Texas, pp. 39–45, (1996).5 Read, D. T. and Marshall, J. C.,”Measurements of Fracture Strength and Young's Modulus of Surface-Micromachined Polysilicon,” Microlithography and Metrology in Micromachining II, SPIE Vol. 2880, pp. 56–63, (1996).6 Sharpe, W. N. Jr., Yuan, B., Edwards, R. L., and Vaidyanathan, R., “Measurements of Young's modulus, Poisson's ratio, and Tensile Strength of Polysilicon”, Proceedings of the Tenth IEEE International Workshop on Microelectromechanical Systems, Nagoya, Japan, pp. 424–429, (1997).7 Jones, P. T., Johnson, G. C., and Howe, R. T., “Fracture Strength of Polycrystalline Silicon”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).8 Chasiotis, I. and Knauss, W., “Mechanical Properties of Thin Polysilicon Films by Means of Probe Microscopy”, Materials and Device Characterization in Micromachining, SPIE Vol. 3512, (1998).9 Brown, S., Muhlstein, C., and Arsdell, W. Van, “Advances in Fatigue Testing of MEMS Materials”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).10 Sharpe, W. N. Jr., Turner, K., and Edwards, R. L., “Polysilicon Tensile Testing with Electrostatic Gripping”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).11 Greek, S. and Johansson, S., “Tensile Testing of Thin Film Microstructures”, Micromachined Devices and Components III - SPIE, Volume 3224, pp. 344–351, (1997).12 Greek, S. and Ericson, F., “Young's Modulus, Yield Strength and Fracture Strength of Microelements Determined by Tensile Testing”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).13 Mullen, R. L., Ballarini, R., Yin, Y., and Heuer, A. H., “Monte Carlo Simulation of Effective Elastic Constants of Polycrystalline Thin Films”, Acta Materialia, Vol. 45, No. 6, pp. 2247–2255, (1997).14 Lee, S. and Cho, D. D., “The Effects of Texture on the Young's Modulus of Polysilicon”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).15 Tsuchiya, T., Tabata, T., Sakata, S., and Tagi, Y., “Specimen Size Effect on Tensile Strength of Surface Micromachined Polycrystalline Silicon Thin Films,” Proceedings of the Tenth IEEE International Workshop on Microelectromechanical Systems, Nagoya, Japan, pp. 529–534, (1997).
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