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RF Plasma CVD Using Hollow Cathode Discharge

Published online by Cambridge University Press:  25 February 2011

Shin Araki
Affiliation:
Fujitsu Laboratories Ltd., 10-1, Morinosato-Wakamiya, Atsugi 243-01, Japan
Hideki Kamaji
Affiliation:
Fujitsu Laboratories Ltd., 10-1, Morinosato-Wakamiya, Atsugi 243-01, Japan
Kazuo Norimoto
Affiliation:
Fujitsu Laboratories Ltd., 10-1, Morinosato-Wakamiya, Atsugi 243-01, Japan
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Abstract

We have made a-Si photoreceptors at low pressure to prevent the formation of SimHn powders and by separating the growing surface from the high density plasma. A new plasma CVD method using a hollow-cathode discharge, where the discharge electrode is the cathode, is described. There is a hollow region in the discharge electrode. Hollow-cathode discharge enables a high density plasma to form at low pressure. The gas is decomposed in the hollow cathode preventing plasma damage to the film. This method allows us to achieve a high deposition rate (10 µm/h) and good quality films for photoreceptors.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

REFERENCES

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